公开(公告)号：US20170004485A1

公开(公告)日：2017-01-05

申请号：US15196810

申请日：2016-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chang-Ho LEE ,  Geon-Soo KIM ,  Won-Kyu KWON ,  Se Chang SOHN ,  Jun-Yong SIM ,  Sung-Jae LIM

IPC: G06Q20/32 ,  G06Q20/34 ,  G06K7/10

CPC classification number: G06Q20/327 ,  G06Q20/3226

Abstract: An apparatus and a method for payment using short range communication are disclosed. The apparatus includes an electronic device having a communication module configured to wirelessly transmit at least one piece card information to an external device, a sensor configured to sense an orientation of the electronic device so as to generate a first signal, a processor configured to be electrically connected the wireless communication module and the sensor, and a memory configured to be electrically connected to the processor and at least temporarily store first card information and second card information, wherein the memory, at the time of execution, includes instructions which instruct the processor to receive the first signal, select one of the first card information and the second card information, at least partially on the basis of the first signal, and wirelessly transmit the selected card information to the external device.

Abstract translation: 公开了一种使用短程通信进行支付的装置和方法。 该装置包括具有通信模块的电子设备，该通信模块被配置为将至少一个卡片信息无线地发送到外部设备;被配置为感测电子设备的方向以便产生第一信号的传感器，被配置为电 连接无线通信模块和传感器，以及被配置为电连接到处理器并且至少临时存储第一卡信息和第二卡信息的存储器，其中在执行时存储器包括指示处理器 接收第一信号，至少部分地基于第一信号选择第一卡信息和第二卡信息之一，并将所选择的卡信息无线发送到外部设备。

公开(公告)号：US20140253168A1

公开(公告)日：2014-09-11

申请号：US14059916

申请日：2013-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gui-Heum CHOI ,  In-Sik KIM ,  Bo-Keun SHIM ,  Sung-Jae LIM

IPC: G01R31/28

CPC classification number: G01R31/2893

Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.

Abstract translation: 可以提供一种用于测试包括梭子，插座和按压单元的半导体封装的装置。 梭子可以包括口袋，其构造成接收半导体封装件和印刷电路板（PCB）。 PCB可以被配置为与半导体封装电接触。 插座可以布置在梭子下面，并且包括被配置为与PCB电接触的插座销。 按压单元可以布置在梭子上，并且可以在垂直方向上移动。 按压单元可以将梭子压向插座，使得半导体封装可以电连接到插座销。 因为容纳在梭中的半导体封装可以在测试区域与插座接触以测试半导体封装，所以半导体封装可能不会脱落或不会倾斜。