公开(公告)号：US20140253168A1

公开(公告)日：2014-09-11

申请号：US14059916

申请日：2013-10-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gui-Heum CHOI ,  In-Sik KIM ,  Bo-Keun SHIM ,  Sung-Jae LIM

IPC: G01R31/28

CPC classification number: G01R31/2893

Abstract: An apparatus for testing a semiconductor package including a shuttle, a socket and a pressing unit may be provided. The shuttle may include a pocket, which is configured to receive the semiconductor package and a printed circuit board (PCB). The PCB may be configured to make electrical contact with the semiconductor package. The socket may be arranged under the shuttle and include socket pins configured to make electrical contact with the PCB. The pressing unit may be arranged on the shuttle and may be movable in a vertical direction. The pressing unit may press on the shuttle toward the socket such that the semiconductor package may be electrically connected to the socket pins. Because the semiconductor package received in the shuttle may make contact with the socket at the testing region to test the semiconductor package, the semiconductor package may not fall off or may not be slanted.

Abstract translation: 可以提供一种用于测试包括梭子，插座和按压单元的半导体封装的装置。 梭子可以包括口袋，其构造成接收半导体封装件和印刷电路板（PCB）。 PCB可以被配置为与半导体封装电接触。 插座可以布置在梭子下面，并且包括被配置为与PCB电接触的插座销。 按压单元可以布置在梭子上，并且可以在垂直方向上移动。 按压单元可以将梭子压向插座，使得半导体封装可以电连接到插座销。 因为容纳在梭中的半导体封装可以在测试区域与插座接触以测试半导体封装，所以半导体封装可能不会脱落或不会倾斜。