公开(公告)号：US09564417B2

公开(公告)日：2017-02-07

申请号：US14848415

申请日：2015-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Bum Byun ,  Cheol Kwon ,  Jong-Yun Yun ,  Do-Il Kong ,  Sung-Chul Hur

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L23/38 ,  H01L23/427 ,  H01L23/433 ,  H01L23/498

CPC classification number: H01L25/0652 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2225/06572 ,  H01L2225/06589

Abstract: A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column.

Abstract translation: 半导体封装的多层叠结构包括沿垂直方向堆叠的多个衬底，安装在多个衬底的每个衬底上的半导体封装，散热柱，其均匀地延伸穿过多个衬底并与至少一个半导体 封装在半导体封装中沿垂直方向作为发热源，以及与散热塔的一端热连接的散热部。

公开(公告)号：US20160086917A1

公开(公告)日：2016-03-24

申请号：US14848415

申请日：2015-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-Bum Byun ,  Cheol Kwon ,  Jong-Yun Yun ,  Do-II Kong ,  Sung-Chul Hur

IPC: H01L25/065 ,  H01L23/02 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L25/0652 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/38 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2225/06572 ,  H01L2225/06589

Abstract: A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column.

Abstract translation: 半导体封装的多层叠结构包括沿垂直方向堆叠的多个衬底，安装在多个衬底的每个衬底上的半导体封装，散热柱，其均匀地延伸穿过多个衬底并与至少一个半导体 封装在半导体封装中沿垂直方向作为发热源，以及与散热塔的一端热连接的散热部。