公开(公告)号：US10582644B1

公开(公告)日：2020-03-03

申请号：US16362732

申请日：2019-03-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Chul Hur ,  Do Il Kong

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/18 ,  H05K1/02 ,  H01R12/71

Abstract: A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

公开(公告)号：US20250138733A1

公开(公告)日：2025-05-01

申请号：US18756018

申请日：2024-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sang Hun JUN ,  Sung Chul Hur ,  Bumjun Kim ,  Jungmoo Son

IPC: G06F3/06

Abstract: A storage adapter includes a carrier and a storage device. The storage device stores data and includes a buffer memory including a volatile memory, a nonvolatile memory, a memory controller that controls the buffer memory and the nonvolatile memory, and a mode signal generating circuit that generates a mode signal, based on a connection state of the storage device and the carrier. The carrier removably receives the storage device, and based on a level of the mode signal, the memory controller selectively performs a data dump operation such that the data stored in the buffer memory are stored in the nonvolatile memory.

公开(公告)号：US11272640B2

公开(公告)日：2022-03-08

申请号：US16740593

申请日：2020-01-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Chul Hur ,  Do Il Kong

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/18 ,  H05K1/02 ,  H01R12/71

Abstract: A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.

公开(公告)号：US20230384848A1

公开(公告)日：2023-11-30

申请号：US18305474

申请日：2023-04-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soo-Young JI ,  Younggeon Yoo ,  Brianmyungjune Jung ,  Sung Chul Hur

IPC: G06F1/26 ,  G06F1/30

CPC classification number: G06F1/263 ,  G06F1/305

Abstract: Disclosed is a storage device including a non-volatile memory that inputs or outputs data at a request of a host system, a volatile memory that temporarily stores data input to or output from the non-volatile memory, an internal spare power source that supplies power to a part of the volatile memory in response to main power supplied from the host system dropping to a first amount or less, and a storage controller that controls the non-volatile memory and the volatile memory. The storage controller is configured to divide the volatile memory into area-received-duplication-power, and at least one area-received-spare-power, in response to the main power dropping to the first amount or less, to redundantly supply spare power to the area-received-duplication-power from an external spare power source and the internal spare power source, and to supply the spare power to the at least one area-received-spare-power from the external spare power source.

公开(公告)号：US11558980B2

公开(公告)日：2023-01-17

申请号：US17665518

申请日：2022-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Chul Hur ,  Do Il Kong

IPC: H05K7/20 ,  H05K5/00 ,  H05K1/18 ,  H05K1/02 ,  H01R12/71

Abstract: A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region.