公开(公告)号：US20250006654A1

公开(公告)日：2025-01-02

申请号：US18630178

申请日：2024-04-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghye BAEK ,  Jeonghyun KIM ,  Hyunjae KANG ,  Ilhwan KIM ,  Jongsu KIM ,  Youngsik PARK ,  Muyoung LEE ,  Sangho JO

IPC: H01L23/544

Abstract: A semiconductor device includes a semiconductor substrate, a first test pattern disposed on the semiconductor substrate, and a second test pattern located adjacent to the first test pattern. The first test pattern includes an overlay pattern, and the second test pattern includes a test element group.