公开(公告)号：US11843190B2

公开(公告)日：2023-12-12

申请号：US17833378

申请日：2022-06-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki Lee ,  Sunwoo Lee ,  Dooseok Choi ,  Seungchan Heo

IPC: H01Q9/04 ,  H01Q1/38

CPC classification number: H01Q9/045 ,  H01Q1/38 ,  H01Q9/0414

Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.

公开(公告)号：US10165566B2

公开(公告)日：2018-12-25

申请号：US15131572

申请日：2016-04-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongsik Myoung ,  Thomas Byunghak Cho ,  Seungchan Heo

IPC: H04W72/04 ,  H04B1/00 ,  H04L5/00

Abstract: Disclosed are a transmitter and method of combining multiple contiguous and non-contiguous frequency bands in a wireless communication system using carrier aggregation. The transmitter includes a first communication unit for converting a first baseband signal into a first RF signal of a first band, a second communication unit for converting a second baseband signal into a second RF signal of a second band, a combiner for outputting a third RF signal by combining the first RF signal and the second RF signal, and an amplifier for amplifying the third RF signal.

公开(公告)号：US12199365B2

公开(公告)日：2025-01-14

申请号：US18387276

申请日：2023-11-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki Lee ,  Sunwoo Lee ,  Dooseok Choi ,  Seungchan Heo

IPC: H01Q9/04 ,  H01Q1/38

Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.

公开(公告)号：US11355850B2

公开(公告)日：2022-06-07

申请号：US16731546

申请日：2019-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki Lee ,  Sunwoo Lee ,  Dooseok Choi ,  Seungchan Heo

IPC: H01Q9/04 ,  H01Q1/38

Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.