PLASMA MONITORING SYSTEM AND METHOD OF MONITORING PLASMA

    公开(公告)号:US20240274419A1

    公开(公告)日:2024-08-15

    申请号:US18529011

    申请日:2023-12-05

    CPC classification number: H01J37/32972 H01J37/32926

    Abstract: A plasma monitoring system includes a chamber with an internal space configured to perform a plasma process on a semiconductor substrate, the chamber including a view window and a substrate stage, a light transmitter on the view window and including optical fibers configured to obtain a first light generated during the plasma process, a detachable reflection mirror between the view window and the optical fibers, a light generator configured to irradiate a second light onto the reflection mirror through the optical fibers and to irradiate a third light onto the view window through the optical fibers, and a light analyzer configured to obtain a light spectrum from the first light, to correct the light spectrum based on the second light reflected from the reflection mirror, and to correct the light spectrum based on the third light reflected from the view window.

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