公开(公告)号：US10048010B2

公开(公告)日：2018-08-14

申请号：US15124622

申请日：2015-03-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Min Cheong ,  Soo Young Lee ,  Seong Ho Kil ,  Moon Il Jung

IPC: F28D7/06 ,  F28D1/053 ,  F28F9/02 ,  F28F1/00 ,  F28F9/16 ,  F28F9/26 ,  F28F21/06 ,  F28F21/08 ,  F28F1/24 ,  F28F1/36 ,  B29C45/14 ,  B23P15/26 ,  B29C45/26 ,  B29C45/33 ,  B29K105/00 ,  B29K705/10 ,  B29L31/18 ,  F28D21/00 ,  F28F1/26 ,  F28F1/34

Abstract: The heat exchanger includes at least one tube array in which refrigerant flows, the tube array includes a plurality of tubes each having a channel formed therein, and connection members coupled to opposite ends of the tubes so as to interconnect the tubes, and the tubes are injection molded integrally with the connection members.

公开(公告)号：US10139139B2

公开(公告)日：2018-11-27

申请号：US15511851

申请日：2015-05-21

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Hee Moon Jeong ,  Seong Ho Kil ,  Seok Uk Kim ,  Keon Kuk ,  Yong Chan Kim ,  Jae Jun Lee ,  Yong Seok Jeon

IPC: F25B29/00 ,  F25B49/02 ,  F25D17/02 ,  F25B40/04 ,  F25B9/08 ,  F25D11/00 ,  F25D17/04 ,  F25B5/02 ,  F25B5/04 ,  F25B40/06 ,  F24F5/00 ,  F25B13/00 ,  F25B40/00

Abstract: Disclosed herein is a refrigeration cycle includes a first refrigerant circuit configured to cause a refrigerant ejected from a compressor to flow through a condenser, an ejector, a first evaporator, and a second evaporator and flow back to the compressor; a second refrigerant circuit configured to cause the refrigerant to bypass the first evaporator in the first refrigerant circuit; and a third refrigerant circuit branching at a junction provided at a downstream end of the condenser from at least one of the first refrigerant circuit and the second refrigerant circuit, and configured to cause the refrigerant to flow through an expansion device and a third evaporator and flow to the ejector. By such configuration, a coefficient of performance (COP) of a refrigeration cycle may be improved and an ejector may be used to improve energy efficiency.

公开(公告)号：US10576485B2

公开(公告)日：2020-03-03

申请号：US14981017

申请日：2015-12-28

Applicant: Samsung Electronics Co., Ltd. ,  Korea University Research and Business Foundation

Inventor： Hee Moon Jeong ,  Yong Taek Hong ,  Seok Uk Kim ,  Seong Ho Kil ,  Bo Heum Kim ,  Yong Chan Kim ,  Jae Jun Lee ,  Yong Seok Jeon

IPC: F25B41/00 ,  B05B7/24

Abstract: As an ejector of the present disclosure and a cooling apparatus having the same include a suction guide unit at least partially having a curved surface so that the ejector guides a flow of a refrigerant, a structure is improved and thus a flow loss can be reduced. Also, through the improved structure, a mixture rate between a refrigerant passing through a nozzle unit and a refrigerant passing through a suction unit is improved, so that pressure rising efficiency can be increased to reduce a compressor load, and thus energy efficiency can be increased due to an increase in efficiency of the ejector.