公开(公告)号：US20250046659A1

公开(公告)日：2025-02-06

申请号：US18671011

申请日：2024-05-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se Ra Lee ,  Jun Yeong Heo ,  Yeong Kwon Ko

IPC: H01L21/66 ,  H01L21/78 ,  H01L23/00

Abstract: A semiconductor package, which may include a semiconductor chip including a first surface and a second surface, which may be opposite to each other in a first direction. The semiconductor package may include a plurality of first bumps in a first area on the first surface and arranged along a second direction that intersects with the first direction, a plurality of second bumps in a second area on the first surface and arranged along the second direction and spaced apart from the plurality of first bumps in a third direction that intersects with the first direction and the second direction, a first test pad in a third area between the first area and the second area, and a third bump on the first test pad. The first test pad may be along an edge of the semiconductor chip in the third direction.