公开(公告)号：US20250022866A1

公开(公告)日：2025-01-16

申请号：US18409931

申请日：2024-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghyeon JEONG ,  Hyunki KIM ,  Junga LEE

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package includes a substrate, a passive element on the substrate, and a connection terminal connecting the substrate to the passive element. The substrate includes a base portion comprising an element pad connected to the connection terminal, and an upper insulating layer on the base portion to expose at least a portion of the base portion. The passive element is in contact with the upper insulating layer, and a thickness of the connection terminal and a thickness of the upper insulating layer are equal to each other.

公开(公告)号：US20250038125A1

公开(公告)日：2025-01-30

申请号：US18623309

申请日：2024-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sanghyeon JEONG ,  Youngmin LEE

IPC: H01L23/552 ,  H01L21/56

Abstract: An apparatus for forming an electromagnetic interference (EMI) shielding film, includes an adhesive member having a pocket region, a support member disposed on or below the adhesive member, the support member having an opening at a position aligned with the pocket region, a coating member configured to form a shielding material layer on the adhesive member and the chip structure disposed on the adhesive member, and a pickup member configured to detach, from the adhesive member, the chip structure covered by the shielding material layer. The support member has a first side surface defining a lower region of the opening, and a second side surface spaced apart from the first side surface in a first direction, the second surface defining an upper region of the opening. A width of the lower region in the first direction is less than a width of the upper region in the first direction.