公开(公告)号：US20180053674A1

公开(公告)日：2018-02-22

申请号：US15469620

申请日：2017-03-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehyun LEE ,  Sangdong KWON ,  Tae-Hwa KIM ,  Minjoon PARK

IPC: H01L21/683 ,  H01J37/32

CPC classification number: H01L21/6831 ,  H01J37/32642 ,  H01J37/32715 ,  H01L21/6833 ,  H01L21/68735 ,  H01L21/68757

Abstract: Disclosed are an electrostatic chuck assembly and a substrate processing apparatus including the same. The substrate processing apparatus comprises a process chamber including an inner space therein, a gas supply unit supplying a process gas into the process chamber, a top electrode section in the process chamber and generating plasma from the process gas, and an electrostatic chuck assembly below the top electrode section in the process chamber. The electrostatic chuck assembly comprises an electrostatic chuck supporting a substrate, a focus ring surrounding an upper portion of the electrostatic chuck, an electrode ring below the focus ring and including a different material from the focus ring, and a brazed bonding layer brazing the focus ring and the electrode ring together, the brazed bonding layer being between the focus ring and the electrode ring.