公开(公告)号：US20190221424A1

公开(公告)日：2019-07-18

申请号：US16164953

申请日：2018-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyeong Lee ,  SOONWOOK JUNG ,  BONGJIN KUH ,  PYUNG MOON ,  SUKJIN CHUNG

IPC: H01L21/02

CPC classification number: H01L21/02118 ,  H01L21/02211 ,  H01L21/02274 ,  H01L21/02282

Abstract: Disclosed are method and apparatus for forming a thin layer. The method for forming the thin layer comprises providing a substrate including patterns, forming a bonding layer on the substrate covering an inner surface of a gap between the patterns, forming a preliminary layer on the bonding layer filling the gap; and thermally treating the preliminary layer to form the thin layer. The bonding layer is a self-assembled monomer layer formed using an organosilane monomer. The preliminary layer is formed from a flowable composition comprising polysilane.