公开(公告)号：US20240185385A1

公开(公告)日：2024-06-06

申请号：US18529286

申请日：2023-12-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Priyadarshini Panemangalore PAI ,  Shashishekara Parampalli ADIGA ,  Prashant Pandurang SHINDE

IPC: G06T3/4076 ,  G06T3/4046 ,  G06T5/50

CPC classification number: G06T3/4076 ,  G06T3/4046 ,  G06T5/50 ,  G06T2207/20081

Abstract: A method and system for screening a plurality of images for performing super-resolution (SR) are provided. The method includes using a multitask learning model (MLM) determining at least one of a plurality of image properties related to each of a plurality of images having a resolution lower than a predefined threshold; and selecting, based on the at least one of the plurality of image properties, a first set of images among the plurality of images to each be respectively suitable for upscaling; recommending, using a recommendation model, at least one parameter based on the at least one of the plurality of image properties; and generating at least one super-resolution image by respectively performing a super-resolution upscaling operation on at least one image of the first set of images based on the at least one parameter and the at least one of the plurality of image properties.

公开(公告)号：US20250148585A1

公开(公告)日：2025-05-08

申请号：US18938110

申请日：2024-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Priyadarshini Panemangalore PAI ,  Prashant Pandurang SHINDE ,  Shashishekara Parampalli ADIGA

IPC: G06T7/00

Abstract: Disclosed is a multi-level defect detection method and system for detecting one or more defects in semiconductor wafers, including forming, among input images of the semiconductor wafers, a first image set of input images in which defects were not detected and a second image set of input images in which defects were detected; extracting image parameters from the first image set and determining whether the first image set can be enhanced; generating an image enhancement profile for the first image set and modifying the first image set based on the image enhancement profile and detecting one or more defects in the modified image set by performing a defect detection process thereon.

公开(公告)号：US20240193758A1

公开(公告)日：2024-06-13

申请号：US18500629

申请日：2023-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Prashant Pandurang SHINDE ,  Shashishekara Parampalli ADIGA ,  Priyadarshini Panemangalore PAI

IPC: G06T7/00 ,  G06T7/11 ,  G06T7/62 ,  G06V10/70

CPC classification number: G06T7/0008 ,  G06T7/11 ,  G06T7/62 ,  G06V10/70 ,  G06T2207/10061 ,  G06T2207/30148 ,  G06V2201/07

Abstract: A processor-implemented method with image generation includes: receiving a plurality of input parameters for a plurality of images to be generated; generating a plurality of defect profiles comprising a size and location of one or more defects to be formed in an image; and generating the plurality of images comprising defect information based on the plurality of defect profiles and the plurality of input parameters using an image rendering operation.

公开(公告)号：US20230054119A1

公开(公告)日：2023-02-23

申请号：US17886946

申请日：2022-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Priyadarshini Panemangalore PAI ,  Prashant Pandurang SHINDE ,  Shashishekara Parampalli ADIGA

IPC: G06T7/00 ,  H01L21/66

Abstract: A method and device with defect detection are included. In one general aspect, a method performed by an electronic device includes determining, by the electronic device, an operation mode among different operation modes, wherein the electronic device is configured to implement the operation modes for determining wafer defects by processing semiconductor wafer images, and determining, by the electronic device, based on an indication of the determined operation mode, whether a semiconductor image, among the semiconductor wafer images, is defective.