公开(公告)号：US20250139762A1

公开(公告)日：2025-05-01

申请号：US18890365

申请日：2024-09-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyunchul KIM ,  Daewoong Choi ,  Ohchel Kwon ,  Hyunmo Kang ,  Taecheon Kim ,  Jinhong Park ,  Wooseok Choe

IPC: G06T7/00 ,  H01L21/66

Abstract: A wafer inspection method includes: obtaining an inspection image by capturing an image of a wafer and an identification tag; obtaining an inspection profile by quantifying the identification tag in the inspection image; and performing a surface inspection of the wafer based on the obtained inspection profile.

公开(公告)号：US20240021414A1

公开(公告)日：2024-01-18

申请号：US18141341

申请日：2023-04-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Suhwan Park ,  Ohchel Kwon ,  Yongmyung Jun ,  Gwanwoo Min ,  Hyeongkwon Jeong

IPC: H01J37/32

CPC classification number: H01J37/32477 ,  H01J37/32522 ,  H01J37/3244 ,  H01J2237/334

Abstract: A shock absorbing plate configured to absorb a shock between a first plate and a second plate stacked on the first plate in a vertical direction, positioned between the first plate and the second plate so that the first plate is apart from the second plate in the vertical direction, and having a circular shape when viewed in the vertical direction. When no pressure is applied to the shock absorbing plate, a vertical thickness of the shock absorbing plate is greatest at a center thereof and decreases from the center toward an outer edge thereof. A plurality of holes penetrate the shock absorbing plate in the vertical direction. A friction coefficient and an elastic modulus of the shock absorbing plate are less than a friction coefficient and an elastic modulus of each of the first plate and the second plate.