SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20240155828A1

    公开(公告)日:2024-05-09

    申请号:US18226049

    申请日:2023-07-25

    CPC classification number: H10B12/315 H10B12/033 H10B12/50

    Abstract: A semiconductor device includes a substrate including a first area and a second area planarly surrounding the first area, a lower electrode disposed on the first area of the substrate and extending in a vertical direction, a supporter surrounding a sidewall of the lower electrode and supporting the lower electrode, a first upper electrode covering the lower electrode, on the lower electrode, the first upper electrode including a first portion disposed within the first area and a second portion disposed within the second area, a dielectric layer arranged between the lower electrode and the first upper electrode, and a second upper electrode disposed on the first portion of the first upper electrode, wherein the second upper electrode is not disposed on the second portion of the first upper electrode.

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