METHOD AND DEVICE FOR TRANSMITTING INTERFERENCE INFORMATION IN WIRELESS COMMUNICATION SYSTEM

    公开(公告)号:US20240114494A1

    公开(公告)日:2024-04-04

    申请号:US17768662

    申请日:2020-10-07

    发明人: Namhoon KIM

    IPC分类号: H04W72/0453 H04W72/541

    CPC分类号: H04W72/0453 H04W72/541

    摘要: The present disclosure relates to a communication technique for combining an IoT technology with a 5G communication system for supporting a higher data transmission rate than a 4G system, and a system therefor. The present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, retail businesses, security and safety-related services, and the like) on the basis of 5G communication technologies and IoT-related technologies. The present invention discloses a method for a base station to transmit interference information in a wireless communication system, the interference information transmission method being characterized by including the steps of: determining whether a frequency resource can be used for resource allocation; generating interference information indicating the interference level of the frequency resource on the basis of the determination; and transmitting the interference information to an adjacent base station, wherein the interference information about the frequency resource has a predetermined value when the frequency resource is not used for resource allocation.

    DEVICE AND METHOD FOR UPLINK POWER CONTROL IN WIRELESS COMMUNICATION SYSTEM

    公开(公告)号:US20230388935A1

    公开(公告)日:2023-11-30

    申请号:US18446853

    申请日:2023-08-09

    发明人: Namhoon KIM

    IPC分类号: H04W52/14 H04W52/36 H04W52/24

    摘要: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th Generation (4G) communication system, such as long term evolution (LTE). A method of operating a user equipment (UE) in a wireless communication system is provided. The method includes receiving, from a base station, downlink control information including a transmit power control (TPC) command, if the UE is related to an unrestricted TPC configuration, the UE reaches maximum transmit power, and a power control value depending on the TPC command is a positive value, determining uplink transmit power, based on the power control value, and transmitting an uplink signal, based on the determined uplink transmit power.

    SEMICONDUCTOR PACKAGE
    5.
    发明申请

    公开(公告)号:US20230117654A1

    公开(公告)日:2023-04-20

    申请号:US17847130

    申请日:2022-06-22

    摘要: A semiconductor package includes a first semiconductor chip; a lower dam structure disposed on an edge of a top surface of the first semiconductor substrate; a second semiconductor chip, which is mounted on the first semiconductor chip; an upper dam structure disposed on an edge of the bottom surface of the second semiconductor substrate; a chip connecting terminal disposed between the first semiconductor chip and the second semiconductor chip and connecting the first semiconductor chip to the second semiconductor chip; and an adhesive layer disposed between the first semiconductor chip and the second semiconductor chip and surrounding the chip connecting terminal.

    SEMICONDUCTOR PACKAGE
    6.
    发明申请

    公开(公告)号:US20220157780A1

    公开(公告)日:2022-05-19

    申请号:US17375511

    申请日:2021-07-14

    IPC分类号: H01L25/065 H01L23/538

    摘要: A semiconductor package including a substrate; a first semiconductor chip on the substrate; a second semiconductor chip on the first semiconductor chip; and at least one connection terminal between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip includes a first semiconductor chip body; and at least one upper pad on a top surface of the first semiconductor chip body and in contact with the at least one connection terminal, the at least one upper pad includes a recess that is downwardly recessed from a top surface thereof, and a depth of the recess is less than a thickness of the at least one upper pad.

    ELECTRONIC DEVICE AND USER UTTERANCE PROCESSING METHOD

    公开(公告)号:US20240212682A1

    公开(公告)日:2024-06-27

    申请号:US18587141

    申请日:2024-02-26

    IPC分类号: G10L15/22 G10L15/19

    CPC分类号: G10L15/22 G10L15/19

    摘要: An electronic device includes: memory storing instructions; and at least one processor. Wherein the instructions which when executed by at least one processor, cause at least one processors to perform control to: receive a first signal corresponding to a first utterance of a user; provide a first response corresponding to the first utterance; obtain cross-domain data based on the first utterance or the first response; receive a second signal corresponding to a second utterance following the first utterance; and provide a second response corresponding to the second utterance based on the cross-domain data when the second utterance includes anaphora. The first utterance and the second utterance respectively correspond to different domains.

    INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

    公开(公告)号:US20230117072A1

    公开(公告)日:2023-04-20

    申请号:US18066487

    申请日:2022-12-15

    摘要: An integrated circuit device includes a semiconductor substrate, first through-silicon-via (TSV) structures penetrating a first region of the semiconductor substrate and spaced apart from each other by a first pitch, a first individual device between the first TSV structures and spaced apart from the first TSV structures by a distance that is greater than a first keep-off distance, and second TSV structures penetrating a second region of the semiconductor substrate and spaced apart from each other by a second pitch that is less than the first pitch. The second region of the semiconductor device does not include an individual device that is homogeneous with the first individual device and between the second TSV structures.