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1.
公开(公告)号:US20240114494A1
公开(公告)日:2024-04-04
申请号:US17768662
申请日:2020-10-07
发明人: Namhoon KIM
IPC分类号: H04W72/0453 , H04W72/541
CPC分类号: H04W72/0453 , H04W72/541
摘要: The present disclosure relates to a communication technique for combining an IoT technology with a 5G communication system for supporting a higher data transmission rate than a 4G system, and a system therefor. The present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, health care, digital education, retail businesses, security and safety-related services, and the like) on the basis of 5G communication technologies and IoT-related technologies. The present invention discloses a method for a base station to transmit interference information in a wireless communication system, the interference information transmission method being characterized by including the steps of: determining whether a frequency resource can be used for resource allocation; generating interference information indicating the interference level of the frequency resource on the basis of the determination; and transmitting the interference information to an adjacent base station, wherein the interference information about the frequency resource has a predetermined value when the frequency resource is not used for resource allocation.
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2.
公开(公告)号:US20240172040A1
公开(公告)日:2024-05-23
申请号:US18425654
申请日:2024-01-29
发明人: Sangkyu BAEK , Soenghun KIM , Namhoon KIM , Myunghwan KIM , Hyoungmin KIM , Sungnam HONG
IPC分类号: H04W28/02 , H04L1/1812 , H04W56/00 , H04W72/56 , H04W74/0833 , H04W76/11 , H04W76/27
CPC分类号: H04W28/0278 , H04L1/1812 , H04W56/0045 , H04W72/56 , H04W74/0833 , H04W76/11 , H04W76/27
摘要: A pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). A user equipment (UE) in a wireless communication system is provided. The UE includes a transceiver, and at least one processor coupled to the transceiver and configured to generate a lone truncated buffer status report (BSR) based on a number of padding bits, and transmit the long truncated BSR informing of data volume for at least one logical channel group among logical channel groups having data for transmission, wherein the data volume for the at least one logical channel group is reported following an order that is determined based on a highest priority logical channel in each of the at least one logical channel group.
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3.
公开(公告)号:US20200053593A1
公开(公告)日:2020-02-13
申请号:US16535976
申请日:2019-08-08
发明人: Sangkyu BAEK , Soenghun KIM , Namhoon KIM , Myunghwan KIM , Hyoungmin KIM , Sungnam HONG
摘要: A pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). A user equipment (UE) in a wireless communication system is provided. The UE includes a transceiver, and at least one processor coupled to the transceiver and configured to generate a lone truncated buffer status report (BSR) based on a number of padding bits, and transmit the long truncated BSR informing of data volume for at least one logical channel group among logical channel groups having data for transmission, wherein the data volume for the at least one logical channel group is reported following an order that is determined based on a highest priority logical channel in each of the at least one logical channel group.
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公开(公告)号:US20230388935A1
公开(公告)日:2023-11-30
申请号:US18446853
申请日:2023-08-09
发明人: Namhoon KIM
CPC分类号: H04W52/146 , H04W52/367 , H04W52/242 , H04W52/365
摘要: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th Generation (4G) communication system, such as long term evolution (LTE). A method of operating a user equipment (UE) in a wireless communication system is provided. The method includes receiving, from a base station, downlink control information including a transmit power control (TPC) command, if the UE is related to an unrestricted TPC configuration, the UE reaches maximum transmit power, and a power control value depending on the TPC command is a positive value, determining uplink transmit power, based on the power control value, and transmitting an uplink signal, based on the determined uplink transmit power.
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公开(公告)号:US20230117654A1
公开(公告)日:2023-04-20
申请号:US17847130
申请日:2022-06-22
发明人: Namhoon KIM , Kwangyoul LEE
IPC分类号: H01L23/16 , H01L25/065 , H01L25/00
摘要: A semiconductor package includes a first semiconductor chip; a lower dam structure disposed on an edge of a top surface of the first semiconductor substrate; a second semiconductor chip, which is mounted on the first semiconductor chip; an upper dam structure disposed on an edge of the bottom surface of the second semiconductor substrate; a chip connecting terminal disposed between the first semiconductor chip and the second semiconductor chip and connecting the first semiconductor chip to the second semiconductor chip; and an adhesive layer disposed between the first semiconductor chip and the second semiconductor chip and surrounding the chip connecting terminal.
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公开(公告)号:US20220157780A1
公开(公告)日:2022-05-19
申请号:US17375511
申请日:2021-07-14
发明人: Ohguk KWON , Namhoon KIM , Hyoeun KIM , Sunkyoung SEO
IPC分类号: H01L25/065 , H01L23/538
摘要: A semiconductor package including a substrate; a first semiconductor chip on the substrate; a second semiconductor chip on the first semiconductor chip; and at least one connection terminal between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip includes a first semiconductor chip body; and at least one upper pad on a top surface of the first semiconductor chip body and in contact with the at least one connection terminal, the at least one upper pad includes a recess that is downwardly recessed from a top surface thereof, and a depth of the recess is less than a thickness of the at least one upper pad.
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7.
公开(公告)号:US20190244612A1
公开(公告)日:2019-08-08
申请号:US16265237
申请日:2019-02-01
发明人: Youngho HAN , Keunseok CHO , Jaeyoung ROH , Namhoon KIM , Chiyoun PARK , Jongyoub RYU
IPC分类号: G10L15/22 , G10L15/02 , G10L25/84 , G10L15/187
CPC分类号: G10L15/22 , G10L15/02 , G10L15/187 , G10L25/84 , G10L2015/025
摘要: A method of processing a speech signal for speaker recognition in an electronic apparatus includes: obtaining a speech signal of a first user; extracting a speech feature comprising a feature value from the speech signal; comparing the speech feature extracted from the speech signal of the first user with a predetermined reference value; selecting a first user feature that corresponds to the speech feature of the first user compared with the reference value; generating a recommended phrase used for speaker recognition based on the first user feature; and outputting the recommended phrase.
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公开(公告)号:US20240212682A1
公开(公告)日:2024-06-27
申请号:US18587141
申请日:2024-02-26
发明人: Taekwang UM , Namhoon KIM , Kyounghoon LEE , Youngki LEE , Heeyoung CHUNG
摘要: An electronic device includes: memory storing instructions; and at least one processor. Wherein the instructions which when executed by at least one processor, cause at least one processors to perform control to: receive a first signal corresponding to a first utterance of a user; provide a first response corresponding to the first utterance; obtain cross-domain data based on the first utterance or the first response; receive a second signal corresponding to a second utterance following the first utterance; and provide a second response corresponding to the second utterance based on the cross-domain data when the second utterance includes anaphora. The first utterance and the second utterance respectively correspond to different domains.
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公开(公告)号:US20230117072A1
公开(公告)日:2023-04-20
申请号:US18066487
申请日:2022-12-15
发明人: Chajea JO , Ohguk KWON , Namhoon KIM , Hyoeun KIM , Seunghoon YEON
IPC分类号: H01L23/48 , H01L21/768 , H01L23/00 , H01L25/065
摘要: An integrated circuit device includes a semiconductor substrate, first through-silicon-via (TSV) structures penetrating a first region of the semiconductor substrate and spaced apart from each other by a first pitch, a first individual device between the first TSV structures and spaced apart from the first TSV structures by a distance that is greater than a first keep-off distance, and second TSV structures penetrating a second region of the semiconductor substrate and spaced apart from each other by a second pitch that is less than the first pitch. The second region of the semiconductor device does not include an individual device that is homogeneous with the first individual device and between the second TSV structures.
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公开(公告)号:US20220377600A1
公开(公告)日:2022-11-24
申请号:US17878338
申请日:2022-08-01
发明人: Sangkyu BAEK , Soenghun KIM , Namhoon KIM , Myunghwan KIM , Hyoungmin KIM , Sungnam HONG
摘要: A pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). A user equipment (UE) in a wireless communication system is provided. The UE includes a transceiver, and at least one processor coupled to the transceiver and configured to generate a lone truncated buffer status report (BSR) based on a number of padding bits, and transmit the long truncated BSR informing of data volume for at least one logical channel group among logical channel groups having data for transmission, wherein the data volume for the at least one logical channel group is reported following an order that is determined based on a highest priority logical channel in each of the at least one logical channel group.
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