公开(公告)号：US20210328330A1

公开(公告)日：2021-10-21

申请号：US17363843

申请日：2021-06-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nak Chung CHOI ,  Gyu Sub KIM ,  Hyung Joo LEE

IPC: H01Q1/24 ,  H01Q3/24 ,  H01Q9/42 ,  H01Q5/364 ,  H01Q21/28

Abstract: An electronic device is provided, which includes a housing; a conductive member forming at least a part of the housing; first to third nonconductive members separating the conductive member, wherein the conductive member includes a first conductive pattern disposed between the first nonconductive member and the second nonconductive member, and a second conductive pattern disposed between the second nonconductive member and the third nonconductive member; a first feeding part connected to the first conductive pattern; a second feeding part connected to the second conductive pattern; a first ground part connected to the first conductive pattern at a point adjacent to the second nonconductive member; and a communication circuit electrically connected with the conductive member.

公开(公告)号：US20190074576A1

公开(公告)日：2019-03-07

申请号：US16125163

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hong Pyo BAE ,  Dong Yeon KIM ,  Ho Jung NAM ,  Sung Koo PARK ,  Jae Woon PARK ,  Min Cheol SEO ,  Him Chan YUN ,  Han Dug LEE ,  Hyun Woo LEE ,  Hyung Joo LEE ,  Byung Man LIM ,  Nak Chung CHOI

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q13/10 ,  H04M1/02 ,  H05K1/02 ,  H01Q1/52 ,  H01Q9/04

Abstract: An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side member surrounding a space between the front plate and the rear plate, the housing including at least one antenna element extended along one portion of the side member, a display exposed through the front plate and including a display panel and a shield layer, a wireless communication circuit electrically connected to the antenna element, a support member, at least a portion of which is positioned in the space in parallel with the shield layer, and a conductive patch layer interposed between the shield layer and the support member.

公开(公告)号：US20200274229A1

公开(公告)日：2020-08-27

申请号：US16871492

申请日：2020-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Nak Chung CHOI ,  Gyu Sub KIM ,  Hyung Joo LEE

IPC: H01Q1/24 ,  H01Q3/24 ,  H01Q9/42 ,  H01Q5/364 ,  H01Q21/28

Abstract: An electronic device is provided, which includes a housing; a conductive member forming at least a part of the housing; first to third nonconductive members separating the conductive member, wherein the conductive member includes a first conductive pattern disposed between the first nonconductive member and the second nonconductive member, and a second conductive pattern disposed between the second nonconductive member and the third nonconductive member; a first feeding part connected to the first conductive pattern; a second feeding part connected to the second conductive pattern; a first ground part connected to the first conductive pattern at a point adjacent to the second nonconductive member; and a communication circuit electrically connected with the conductive member.