公开(公告)号：US20220137180A1

公开(公告)日：2022-05-05

申请号：US17574397

申请日：2022-01-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungrok LEE ,  Minhong DO ,  Seongjin PARK ,  Seokwoo LEE ,  Sukchan HONG ,  Jaebong CHUN ,  Hyunsuk CHOI

IPC: G01S7/03 ,  H04B7/0404 ,  G01S7/41 ,  G01S13/86 ,  G01S7/02

Abstract: An electronic device according to various embodiments of the present disclosure may include a plurality of antenna arrays and at least one processor operatively connected to the plurality of antenna arrays. The at least one processor may transmit a first radio signal including a specific polarization, generated through a first antenna array of the plurality of antenna arrays. The at least one processor may receive a second radio signal which is a reflected signal of the first radio signal and includes the specific polarization, generated through a second antenna array different from the first antenna array of the plurality of antenna arrays. The at least one processor may identify external objects around the electronic device on the basis of the second radio signal. Other various embodiments may be possible.

公开(公告)号：US20240094784A1

公开(公告)日：2024-03-21

申请号：US18470716

申请日：2023-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minhong DO ,  Yongwoon KIM ,  Eunsoo PARK ,  Jaebum BAE ,  Yonglak CHO

IPC: G06F1/16

CPC classification number: G06F1/1681

Abstract: According to an embodiment of the disclosure, an electronic device may comprise a housing including a first housing and a second housing configured to rotate relative to the first housing and a hinge module rotatably coupling the first housing and the second housing and received in the housing. The hinge module includes a hinge housing including a receiving space, a spring positioned in the receiving space of the hinge housing, a supporting member including an inclined portion coupled to one end of the spring, and a cam coupled to another end of the spring and configured to transfer force to the spring.

公开(公告)号：US20210159599A1

公开(公告)日：2021-05-27

申请号：US17104441

申请日：2020-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongjin PARK ,  Minhong DO ,  Kyungrok LEE ,  Seokwoo LEE ,  Sukchan HONG ,  Jaebong CHUN ,  Hyunsuk CHOI

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q1/42 ,  H01Q21/10

Abstract: Disclosed is an electronic device including a housing having a front surface, a rear surface, and a side surface partially surrounding a space between the front surface and the rear surface, wherein at least one of the front surface, the rear surface, and the side surface comprises a non-conductive portion, and at least a partial region of the non-conductive portion comprises a first through hole, a component at least partially overlapping the first through hole when the non-conductive portion is viewed from outside the housing, wherein the component is disposed at a position spaced apart from the non-conductive portion by a first distance, and an antenna structure disposed at a position spaced apart from the non-conductive portion by a second distance shorter than the first distance, wherein the antenna structure is configured to radiate radio waves through the non-conductive portion, and comprises at least one second through hole.

公开(公告)号：US20220029272A1

公开(公告)日：2022-01-27

申请号：US17493326

申请日：2021-10-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sukchan HONG ,  Minhong DO ,  Seongjin PARK ,  Kyungrok LEE ,  Seokwoo LEE ,  Jaebong CHUN ,  Hyunsuk CHOI

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q21/00

Abstract: Disclosed is an electronic device including a plurality of radio frequency integrated circuits (RFICs) that delivers a digital signal, which is to be transmitted by a modem through an antenna configured to transmit and/or receive a radio frequency (RF) signal, in a form of the RF signal and to deliver the RF signal received from the antenna, in a direction of the modem, wherein the plurality of RFICs are at least partially connected to one another, an inter frequency integrated circuit (IFIC) connected to at least some RFICs among the plurality of RFICs and configured to receive the digital signal from the modem, to convert the digital signal to an inter frequency (IF) signal, to deliver the IF signal to the RFIC, to convert the RF signal delivered from the RFIC to the IF signal, and to deliver the IF signal to the modem, and a plurality of compensation units respectively connected to the plurality of RFICs or respectively positioned inside of the plurality of RFICs, the compensation units comprising circuitry configured to compensate for a loss of the IF signal occurring between the IFIC and the at least some RFICs or to compensate for a loss of the IF signal occurring between the plurality of RFICs.