公开(公告)号：US20250107190A1

公开(公告)日：2025-03-27

申请号：US18652010

申请日：2024-05-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonggu LEE ,  Hyeonjin KIM ,  Kyungwon KANG ,  Hyunjae KANG ,  Youngha KIM ,  Jeonggil KIM ,  Jinman KIM ,  Sunghyup KIM ,  Sanghoon LEE

IPC: H01L29/04 ,  H01L23/00 ,  H01L23/498

Abstract: A semiconductor device may include a first semiconductor structure including a first device layer on an upper surface of a first substrate structure, the first device layer including a first region of the semiconductor device; and a second semiconductor structure including a second device layer on a lower surface of a second substrate structure, the second device layer connected to the first device layer and including a second region of the semiconductor device. The first substrate structure may include a first wafer and a second wafer on the first wafer. The second wafer may be in contact with the first device layer. The second substrate structure may include a third wafer and a fourth wafer on a lower surface of the third wafer. The fourth wafer may be in contact with the second device layer. An upper surface of the second wafer may be a (100) crystal plane.

公开(公告)号：US20230333467A1

公开(公告)日：2023-10-19

申请号：US17964376

申请日：2022-10-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghwan KIM ,  Kyungwon KANG ,  Dongwook KIM ,  Seungjoon SONG ,  Seok HEO ,  Younseon WANG ,  Dasom LEE

IPC: G03F7/00 ,  G03F7/30

CPC classification number: G03F7/0025 ,  G03F7/3021

Abstract: A spin coater may include a spin chuck, a nozzle, a first temperature controller and a second temperature controller. The spin chuck may be configured make contact with a central portion of a lower surface of a substrate and may be configured to rotate the substrate when photoresist is on the substrate. The nozzle may be arranged over a central portion of the spin chuck and configured to provide a central portion of an upper surface of the substrate with photoresist. The first temperature controller may be configured to control a temperature in a first region of the spin chuck. The second temperature controller may be configured to control a temperature in a second region of the spin chuck.

公开(公告)号：US20210156031A1

公开(公告)日：2021-05-27

申请号：US16932194

申请日：2020-07-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong PARK ,  Mitsuaki KOMINO ,  Kyungwon KANG ,  Wonguk SEO ,  Sunggwang LEE ,  Sunghwan LEE

IPC: C23C16/52 ,  C23C16/56 ,  G03F7/16

Abstract: An apparatus for processing a substrate may include a mixture bath, a plurality of reaction chambers and a control module. The mixture bath may be configured to receive a plurality of chemicals to form a mixture. Each of the reaction chambers may be configured to receive a respective substrate of a plurality of the substrates to be processed by the mixture. The control module may be configured to control supply of the mixture supplied from the mixing bath to the reaction chambers with a uniform concentration.