公开(公告)号：US20190043839A1

公开(公告)日：2019-02-07

申请号：US16151652

申请日：2018-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ki Hun YU ,  Tae Young OH ,  Nam Jong KIM ,  Kwang II PARK ,  Chul Sung PARK

IPC: H01L25/065 ,  H01L23/34

Abstract: In one example embodiment, a semiconductor system includes a first chip configured to generate first temperature information of the first chip, the first temperature information being based on at least one temperature measurement using at least one first temperature sensor. The semiconductor system further includes a second chip including a second temperature sensor configured to be controlled based on at least the first temperature information.