公开(公告)号：US20250029906A1

公开(公告)日：2025-01-23

申请号：US18646834

申请日：2024-04-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyounglim Suk ,  Kimin Cheong ,  Hyeonjeong Hwang

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L25/00 ,  H01L25/18

Abstract: Provided are a semiconductor package including a pad with high reliability and a method of manufacturing the semiconductor package. The semiconductor package includes a first redistribution substrate, a semiconductor chip on the first redistribution substrate, a through post extending around the semiconductor chip and on the first redistribution substrate, and a second redistribution substrate on the semiconductor chip and the through post. A first pad region and a second pad region are defined on an upper surface of the second redistribution substrate, the first pad region positioned at a central portion of the second redistribution substrate, and the second pad region extending around the first pad region, a first-type pad in a planar shape is in a first opening, a second-type pad having an outer protruding portion is in a second opening.