公开(公告)号：US20230029151A1

公开(公告)日：2023-01-26

申请号：US17591144

申请日：2022-02-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung Gyun NOH ,  Keun-Ho RHEW ,  Sang Woo PAE ,  Jin Soo BAE ,  Deok-Seon CHOI ,  Il-Joo CHOI

IPC: H01L23/498 ,  H01L23/532 ,  H01L23/14

Abstract: The present disclosure provides a semiconductor package capable of improving performance and reliability. The semiconductor package of the present disclosure includes a first device and a second device that are electrically connected to each other, the first device includes a substrate, a first pad formed on an upper side of the substrate, and a passivation film formed on the upper side of the substrate and formed to surround the first pad, the second device includes a second pad placed to face the first pad, and the first pad has a center pad having a first elastic modulus and an edge pad having a second elastic modulus smaller than the first elastic modulus, the edge pad formed to surround the center pad and to contact the passivation film.