公开(公告)号：US20250046754A1

公开(公告)日：2025-02-06

申请号：US18664499

申请日：2024-05-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun-Mook Choi ,  Keum Hyo Kang

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/42 ,  H01L23/48 ,  H01L23/538 ,  H10B80/00

Abstract: A semiconductor package includes a package substrate including a trench; a first chip structure including a first buffer chip and a plurality of first semiconductor chips on the first buffer chip; and a second chip structure including a second buffer chip and a second semiconductor chip on the second buffer chip, wherein one of the first and second chip structures is on the trench, the other one of the first and second chip structures is on a top surface of the package substrate, a first physical layer (PHY) region of the first buffer chip overlaps with a second PHY region of the second buffer chip in a direction perpendicular to the top surface of the package substrate.