SUBSTRATE PROCESSING APPARATUS
    1.
    发明公开

    公开(公告)号:US20240060185A1

    公开(公告)日:2024-02-22

    申请号:US18231400

    申请日:2023-08-08

    CPC classification number: C23C16/482 C23C16/4585

    Abstract: A substrate processing apparatus includes a chamber including a susceptor to support a substrate, a reflective housing outside the chamber, a light source in the reflective housing, the light source being configured to emit a light toward the susceptor, and a light adjuster between the light source and the susceptor, the light adjuster including a support portion supported inside the chamber and a lens coupled to the support portion, and the lens including a transmission portion configured to transmit the light and a scattering pattern portion configured to scatter the light.

    SUBSTRATE PROCESSING APPARATUS
    2.
    发明申请

    公开(公告)号:US20210384012A1

    公开(公告)日:2021-12-09

    申请号:US17173702

    申请日:2021-02-11

    Abstract: A substrate processing apparatus includes a chamber housing with an upper portion opened, the chamber housing defining a reaction space, a susceptor configured to support a substrate in the chamber housing, and a dielectric cover covering an upper portion of the chamber housing. The dielectric cover includes a dielectric lid, and a mode modifying assembly arranged around the dielectric lid to be spaced apart from the dielectric lid, the mode modifying assembly configured to adjust a distance from the dielectric lid.

Patent Agency Ranking