SEMICONDUCTOR PACKAGE
    1.
    发明申请

    公开(公告)号:US20250140668A1

    公开(公告)日:2025-05-01

    申请号:US18672313

    申请日:2024-05-23

    Abstract: A semiconductor package includes a first redistribution substrate comprising first redistribution patterns and first redistribution insulating layers covering the first redistribution patterns, a conductive post on the first redistribution substrate, extending in a direction perpendicular to a top surface of the first redistribution substrate and electrically connected to a corresponding one of the first redistribution patterns, a first semiconductor chip on the first redistribution substrate and laterally spaced apart from the conductive post, and a second redistribution substrate on the conductive post and the first semiconductor chip and comprising second redistribution patterns. The conductive post is electrically connected to a corresponding one of the second redistribution patterns. A top surface of the conductive post faces the second redistribution substrate. The conductive post includes contact holes extending from the top surface of the conductive post into the conductive post. The corresponding second redistribution pattern fills the contact holes.

    DISPLAY MODULE, AND METHOD FOR TRANSMITTING CONTROL SIGNAL FOR DISPLAY MODULE

    公开(公告)号:US20230333799A1

    公开(公告)日:2023-10-19

    申请号:US18341304

    申请日:2023-06-26

    CPC classification number: G06F3/1446

    Abstract: A display module may comprise: at least one first antenna configured to receive an image signal corresponding to the display module, from among a plurality of display modules configured to display an entire image, which displays at least a part of the entire image, a second antenna configured to receive a trigger signal corresponding to the image signal, a signal generation circuit configured to generate a plurality of control signals for controlling the image signal from the trigger signal received through the second antenna, and a display panel configured to display the image signal received from the first antenna on the basis of the plurality of generated control signals.

    DISPLAY PANEL MODULE AND ELECTRONIC DEVICE INCLUDING MULTIPLE DISPLAY PANEL MODULES

    公开(公告)号:US20210365082A1

    公开(公告)日:2021-11-25

    申请号:US17177542

    申请日:2021-02-17

    Abstract: A display panel module and an electronic device is provided, the display pane module including a plurality of display panel modules. According to the disclosure, an electronic device comprises: a housing, a cover glass, a plurality of display panels disposed adjacent to a rear surface of the cover glass in the housing, a plurality of first heat dissipation plates disposed adjacent to rear surfaces of the plurality of display panels in the housing, a plurality of power/data reception circuit boards disposed adjacent to rear surfaces of the plurality of first heat dissipation plates in the housing, a support configured to support at least a portion of the plurality of power/data reception circuit boards, and a power/data transmission circuit board having at least a portion contacting and supported by the support and spaced apart by a predetermined distance from the plurality of power/data reception circuit boards in a space provided by the support. The power/data transmission circuit board includes a plurality of first antennas corresponding to a plurality of second antennas included in each of the plurality of power/data reception circuit boards and a transmission resonator corresponding to a plurality of reception resonators included in each of the plurality of power/data reception circuit boards.

    SEMICONDUCTOR PACKAGE
    5.
    发明申请

    公开(公告)号:US20250118639A1

    公开(公告)日:2025-04-10

    申请号:US18672349

    申请日:2024-05-23

    Abstract: A semiconductor package includes a first redistribution structure including upper pads; a semiconductor chip disposed on the first redistribution structure; an encapsulant on the first redistribution structure and surrounding the semiconductor chip; a second redistribution structure disposed on the encapsulant and including an upper redistribution layer; a plurality of posts penetrating the encapsulant and electrically connecting the upper pads of the first redistribution structure to the upper redistribution layer of the second redistribution structure; metal layers between the upper pads and the plurality of posts and having an upper surface having a first step difference with an upper surface of an edge of the upper pads; and a seed layer between the metal layers and the plurality of posts.

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