公开(公告)号：US20250118639A1

公开(公告)日：2025-04-10

申请号：US18672349

申请日：2024-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjo KIM ,  Junhyeong PARK ,  Sunhyung KIM ,  Jieun PARK ,  Jihye SHIM ,  Yuseon HEO

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes a first redistribution structure including upper pads; a semiconductor chip disposed on the first redistribution structure; an encapsulant on the first redistribution structure and surrounding the semiconductor chip; a second redistribution structure disposed on the encapsulant and including an upper redistribution layer; a plurality of posts penetrating the encapsulant and electrically connecting the upper pads of the first redistribution structure to the upper redistribution layer of the second redistribution structure; metal layers between the upper pads and the plurality of posts and having an upper surface having a first step difference with an upper surface of an edge of the upper pads; and a seed layer between the metal layers and the plurality of posts.