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公开(公告)号：US12222416B2
公开(公告)日：2025-02-11
申请号：US17668528
申请日：2022-02-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunkee Min , Chiho Kim , Junghun Lee , Taehun Lim , Junsu Choi
Abstract: According to various embodiments, an electronic device using a millimeter wave comprises: a first antenna array; a second antenna array; a communication circuit; and at least one processor, wherein the at least one processor may be configured to: control the communication circuit to output a first signal through the first antenna array; when a first reflected signal acquired from the first signal reflected by an object is received through the second antenna array, determine the range between the object and the electronic device on the basis of the first reflected signal; determine an output period of a second signal on the basis of the determined range; control the communication circuit to output the second signal through the first antenna array according to the determined output period; and when a second reflected signal acquired from the second signal reflected by the object is received through the second antenna array, identify an attribute of the object on the basis of the second reflected signal. Various other embodiments may be possible.
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公开(公告)号：US20230011141A1
公开(公告)日：2023-01-12
申请号：US17689026
申请日：2022-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
Abstract: A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.
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公开(公告)号：US11240664B2
公开(公告)日：2022-02-01
申请号：US16957445
申请日：2019-01-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghun Lee , Chounjong Nam , Doosuk Kang , Sunkey Lee , Bokun Choi
IPC: H04W12/06
Abstract: The electronic device according to various embodiments comprises: a housing structure; a user interface located in the housing structure; a network interface that can be connected by wire or wirelessly; a wireless communication circuit configured to communicate with an external device by using frequencies between 10 GHz and 100 GHz; a processor located in the housing structure and operatively connected to the user interface, the network interface, and the wireless communication circuit; and a memory located in the housing structure and operatively connected to the processor. When the memory is running, the processor may: establish a first communication channel with a first external device by means of the wireless communication circuit; receive authentication information from the first external device by means of the first communication channel; receive data from the first external device by means of the first communication channel, while or after receiving the authentication information; store the received data in the memory at least temporarily; establish a second communication channel with a second external device by means of the network interface, by using the authentication information; and store commands for transmitting the stored data to the second external device by means of the second communication channel. Other embodiments are possible.
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公开(公告)号：US11171701B2
公开(公告)日：2021-11-09
申请号：US16620699
申请日：2018-05-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunkee Min , Gongbo Moon , Sunkee Lee , Taehun Lim , Minwhoa Hong , Doosuk Kang , Chounjong Nam , Junghun Lee , Bokun Choi
IPC: H04B7/06 , H04B7/0408 , H04W36/06 , H04B7/0404
Abstract: Various embodiments of the present invention relate to an electronic device for controlling communications. The electronic device may comprise: a housing including a first side and a second side facing the first side; a touch screen display exposed through the first side; a wireless communication unit for generating a directional beam in order to establish a wireless communication channel with an external electronic device; a sensor mounted in the housing; at least one processor mounted in the housing and electrically coupled to the display, the wireless communication unit and the sensor; and a memory mounted in the housing and electrically coupled to the at least one processor. The memory according to the various embodiments of the present invention is, when executed, characterized in that the processor is configured to: perform a first direction search for determining the direction of the directional beam corresponding to a first section, wherein the first section falls within a range corresponding to the direction of the electronic device; detect a change in direction of the electronic device by using the wireless communication unit and the sensor; and in response to the change of direction, perform, at least partially, a second direction search corresponding to a second section on the basis of the detected direction change, wherein the second section falls within a range corresponding to the changed direction of the electronic device, and the second section has a smaller range than that of the first section. Other embodiments are possible.
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公开(公告)号：US11133848B2
公开(公告)日：2021-09-28
申请号：US16620699
申请日：2018-05-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunkee Min , Gongbo Moon , Sunkee Lee , Taehun Lim , Minwhoa Hong , Doosuk Kang , Chounjong Nam , Junghun Lee , Bokun Choi
IPC: H04B7/06 , H04B7/0408 , H04W36/06 , H04B7/0404
Abstract: Various embodiments of the present invention relate to an electronic device for controlling communications. The electronic device may comprise: a housing including a first side and a second side facing the first side; a touch screen display exposed through the first side; a wireless communication unit for generating a directional beam in order to establish a wireless communication channel with an external electronic device; a sensor mounted in the housing; at least one processor mounted in the housing and electrically coupled to the display, the wireless communication unit and the sensor; and a memory mounted in the housing and electrically coupled to the at least one processor. The memory according to the various embodiments of the present invention is, when executed, characterized in that the processor is configured to: perform a first direction search for determining the direction of the directional beam corresponding to a first section, wherein the first section falls within a range corresponding to the direction of the electronic device; detect a change in direction of the electronic device by using the wireless communication unit and the sensor; and in response to the change of direction, perform, at least partially, a second direction search corresponding to a second section on the basis of the detected direction change, wherein the second section falls within a range corresponding to the changed direction of the electronic device, and the second section has a smaller range than that of the first section. Other embodiments are possible.
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Patent Agency Ranking
公开(公告)号：US12217504B2
公开(公告)日：2025-02-04
申请号：US18112726
申请日：2023-02-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junsu Choi , Hyunkee Min , Jihoon Sung , Sunkee Lee , Junghun Lee
IPC: G06V20/20 , G06F3/0483 , G01S5/02
Abstract: An electronic device may include a display, a camera, a communication circuitry, and a processor, wherein the processor may be configured to: control to transmit an image obtained through the camera to an external device through the communication circuitry, receive an AR image including at least one object from the external device through the communication circuitry and display same through the display, recognize a target object from among the at least one object, and map one of peripheral devices found on a data communication link through the communication circuitry to a target device corresponding to the recognized target object. Various embodiments are possible.
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公开(公告)号：US12125954B2
公开(公告)日：2024-10-22
申请号：US17689026
申请日：2022-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junghun Lee , Kyoungjun Kim , Sun Kim , Seolyoung Choi
CPC classification number: H01L33/56 , H01L25/13 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/486 , H01L33/62 , H01L2933/0025 , H01L2933/005
Abstract: A semiconductor light emitting device package includes a circuit board with an upper pad, a light emitting diode chip on the circuit board and having a first surface facing the circuit board and a second surface opposing the first surface, and the light emitting diode chip including a substrate, a semiconductor stack structure on the substrate that emits ultraviolet light, and electrodes connected to the semiconductor stack structure, connection bumps between the circuit board and the light emitting diode chip, the connection bumps connecting the upper pad and the electrodes, an underfill resin on the upper pad of the circuit board and covering at least a portion of a side surface of the light emitting diode chip, and a passivation layer on the light emitting diode chip and the underfill resin, the passivation layer covering the underfill resin and being spaced apart from the semiconductor stack structure.
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公开(公告)号：US20220294489A1
公开(公告)日：2022-09-15
申请号：US17695371
申请日：2022-03-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyunkee MIN , Sungbin Min , Yi Yang , Jaeho Yoon , Junghun Lee
IPC: H04B1/7163 , H04W28/02
Abstract: According to various embodiments, an electronic device may comprise an ultra-wideband (UWB) communication circuit, a Wi-Fi communication circuit and a processor controlling the UWB communication circuit and the Wi-Fi communication circuit. The processor may be configured to identify an operation channel of the UWB communication circuit, identify a communication band of the Wi-Fi communication circuit, overlapping the operation channel of the UWB communication circuit, and when the communication band overlapping the operation channel is activated, determine whether to simultaneously perform Wi-Fi communication through the activated communication band and UWB communication through the operation channel. Other various embodiments are possible as well.
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公开(公告)号：US11375469B2
公开(公告)日：2022-06-28
申请号：US16939326
申请日：2020-07-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyunkee Min , Junsu Choi , Chiho Kim , Junghun Lee , Taehun Lim
IPC: H04W56/00 , H04B7/0456 , H04W64/00
Abstract: An electronic device according to an embodiment includes an mmWave communication module and a processor. The processor is configured to receive a first signal transmitted by a first external electronic device, identify a distance of a transmission path of the first signal, transmit a second signal, receive a third signal obtained when the second signal is reflected, identify a distance of a transmission path of the second signal based on a difference between a transmission time of the second signal and a reception time of the third signal, and determine whether the transmission path of the first signal is a line of sight (LoS) path between the electronic device and the first external electronic device based on a difference between the distance of the transmission path of the first signal and the distance of the transmission path of the second signal. In addition, other embodiments are possible.
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公开(公告)号：US12288837B2
公开(公告)日：2025-04-29
申请号：US17569323
申请日：2022-01-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghun Lee , Kyoungjun Kim , Seolyoung Choi
Abstract: A semiconductor light emitting device package, includes: a ceramic substrate having first and second electrode structures; a light emitting diode chip mounted on the ceramic substrate, electrically connected to the first and second electrode structures, and configured to emit ultraviolet light; a sidewall structure disposed on the ceramic substrate, providing a cavity surrounding the light emitting diode chip, and including an alloy having a thermal expansion coefficient in a range of 2 to 10 ppm/° C. and a Young's modulus in a range of 100 to 300 Gpa; and a glass cover disposed on the sidewall structure to seal the cavity.
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