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公开(公告)号：US10403962B2
公开(公告)日：2019-09-03
申请号：US15775545
申请日：2016-11-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Hwan Yeom , Bong-Soo Kang , Dae-Hun Jung
Abstract: An electronic device according to various embodiments is provided and includes a conductive inner module in which a plurality of layers are stacked; an electrical opening formed in at least a portion of the rim of the conductive inner module when stacking the plurality of layers; and an antenna module disposed at the periphery of the electrical opening, wherein the antenna module may include a feeding part formed on at least one of a plurality of layers forming the conductive inner module, and a conductive pattern which is connected to the feeding part and disposed circumferencing at least one of the electrical openings.
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公开(公告)号：US10454154B2
公开(公告)日：2019-10-22
申请号：US15775545
申请日：2016-11-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-Hwan Yeom , Bong-Soo Kang , Dae-Hun Jung
Abstract: An electronic device according to various embodiments is provided and includes a conductive inner module in which a plurality of layers are stacked; an electrical opening formed in at least a portion of the rim of the conductive inner module when stacking the plurality of layers; and an antenna module disposed at the periphery of the electrical opening, wherein the antenna module may include a feeding part formed on at least one of a plurality of layers forming the conductive inner module, and a conductive pattern which is connected to the feeding part and disposed circumferencing at least one of the electrical openings.
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