SEMICONDUCTOR MEMORY DEVICE
    1.
    发明申请

    公开(公告)号:US20220102358A1

    公开(公告)日:2022-03-31

    申请号:US17461051

    申请日:2021-08-30

    Abstract: A semiconductor memory device may include at least one semiconductor pattern including a horizontal portion extending in a second direction parallel to a top surface of a semiconductor substrate and a vertical portion extending in the first direction, at least one gate electrode on the horizontal portion of the at least one semiconductor pattern and extending in a third direction different from the first direction and the second direction, and at least one information storage element connected to the vertical portion of the at least one semiconductor pattern, wherein a thickness of the horizontal portion of the at least one semiconductor pattern in the first direction is smaller than a thickness of the vertical portion of the at least one semiconductor pattern in the first direction.

    SEMICONDUCTOR MEMORY DEVICE
    2.
    发明公开

    公开(公告)号:US20240292608A1

    公开(公告)日:2024-08-29

    申请号:US18659188

    申请日:2024-05-09

    CPC classification number: H10B12/50 H10B12/33 G11C5/063

    Abstract: A semiconductor memory device may include at least one semiconductor pattern including a horizontal portion extending in a second direction parallel to a top surface of a semiconductor substrate and a vertical portion extending in the first direction, at least one gate electrode on the horizontal portion of the at least one semiconductor pattern and extending in a third direction different from the first direction and the second direction, and at least one information storage element connected to the vertical portion of the at least one semiconductor pattern, wherein a thickness of the horizontal portion of the at least one semiconductor pattern in the first direction is smaller than a thickness of the vertical portion of the at least one semiconductor pattern in the first direction.

Patent Agency Ranking