公开(公告)号：US20230049855A1

公开(公告)日：2023-02-16

申请号：US17718402

申请日：2022-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghyun CHO ,  Joonsik SOHN LEE ,  Chulhwan CHOO

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/48

Abstract: A semiconductor package includes a semiconductor package includes first, second, third and fourth semiconductor chips sequentially stacked on one another. Each of the first, second, third and fourth semiconductor chips includes a first group of bonding pads and a second group of bonding pads alternately arranged in a first direction and input/output (I/O) circuitry selectively connected to the first group of bonding pads respectively. Each of the first, second and third semiconductor chips includes a first group of through electrodes electrically connected to the first group of bonding pads and a second group of through electrodes electrically connected to the second group of bonding pads.