公开(公告)号：US20230418240A1

公开(公告)日：2023-12-28

申请号：US18462807

申请日：2023-09-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hunyoung RYU ,  Kijung KIM ,  Jonggwang JANG ,  Dasol JUN

IPC: G04G17/04 ,  H05K7/20 ,  G04G17/02 ,  G04G17/08 ,  H01Q1/44 ,  G04G19/00 ,  H01Q1/27

CPC classification number: G04G17/04 ,  H05K7/2039 ,  G04G17/02 ,  H01Q1/273 ,  H01Q1/44 ,  G04G19/00 ,  G04G17/08

Abstract: In various embodiments, an electronic device may comprise: a housing including a front plate, a rear plate opposite to the front plate, and a side frame surrounding the space between the front plate and the rear plate; and a printed circuit board disposed in the space and having a front end module (FEM) and a heating element comprising a thermally conductive material mounted thereon, wherein the side frame is segmented into at least a first metal portion and a second metal portion, a segmentation member comprising a non-conductive material is disposed between the first metal portion and the second metal portion, and the first metal portion is electrically connected to the front end module, and the second metal portion is connected to the heating element by heat transfer members comprising a thermal interface material.

公开(公告)号：US20250147560A1

公开(公告)日：2025-05-08

申请号：US19002262

申请日：2024-12-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chungsoon PARK ,  Junghyun KANG ,  Hyohoon SHIN ,  Jeongho AHN ,  Heeyoung YUN ,  Jonggwang JANG ,  Dongheon JANG

IPC: G06F1/20 ,  G04G17/04 ,  H04M1/02

Abstract: Provided is an electronic device including a motor housing. The electronic device including at least one heat generating element may include a printed board assembly on which the heat generating element is disposed; a battery; a battery support frame configured to support the battery therein; and a motor disposed between the printed board assembly and the battery support frame. The motor may include a motor housing including a first surface configured to directly or indirectly contact the printed board assembly and to receive a heat of the heat generating element from the printed board assembly, and a second surface configured to directly or indirectly contact the battery support frame and to transfer a heat of the heat generating element to the battery support frame.