公开(公告)号：US20250105030A1

公开(公告)日：2025-03-27

申请号：US18782816

申请日：2024-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD

Inventor： Jieun SEO ,  Donghoon KWON

IPC: H01L21/67 ,  H01L21/02

Abstract: A substrate cleaning device includes a cleaning module configured to spray a cleaning solution on an upper side of a substrate, a curtain module coupled with the cleaning module and configured to spray a curtain body to at least one of a first area including an upper side of an edge of the substrate, a second area between a cleaner guard at least partially surrounding the substrate and a first upper portion of the edge of the substrate, and a third area including a second upper portion of an outside of the edge of the substrate in parallel to an internal wall of the cleaner guard, and a driver coupled with the cleaning module and configured to horizontally move the cleaning module on a third upper portion of the substrate.

公开(公告)号：US20240238849A1

公开(公告)日：2024-07-18

申请号：US18392348

申请日：2023-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jieun SEO ,  Donghoon KWON

IPC: B08B3/02 ,  B05B1/02

CPC classification number: B08B3/024 ,  B05B1/02 ,  B08B2203/02

Abstract: A wafer cleaning apparatus including a rotating plate configured to support a wafer thereon, and a cleaning unit above the rotating plate and configured to spray cleaning water, wherein the cleaning unit includes a body, a nozzle in the body, at least one supply pipe connected to the nozzle and configured to supply a cleaning substance, and a discharge member at a lower end portion of the nozzle and configured to discharge the cleaning water, which includes the cleaning substance, wherein the discharge member has a spraying port configured spray the cleaning water therethrough, and wherein the spraying port has an X shape may be provided.