公开(公告)号：US09947809B2

公开(公告)日：2018-04-17

申请号：US13673359

申请日：2012-11-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se Yun Kim ,  Suk Jun Kim ,  Eun Sung Lee ,  Sang Soo Jee ,  Jeong Na Heo

IPC: H01L31/00 ,  H01L21/00 ,  H01B1/02 ,  H01J1/14 ,  H01B1/22 ,  H01L31/0224 ,  H01L31/18 ,  C22C21/00 ,  B22F1/00 ,  C22C45/00 ,  C22C45/08 ,  B23K35/28 ,  B23K35/30 ,  B23K35/02 ,  H01L31/068 ,  B22F3/10

CPC classification number: H01L31/0224 ,  B22F1/0059 ,  B22F3/10 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/0261 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3033 ,  C22C21/00 ,  C22C45/00 ,  C22C45/08 ,  H01B1/22 ,  H01L31/022425 ,  H01L31/0682 ,  H01L31/18 ,  Y02E10/547

Abstract: A conductive paste includes a conductive powder, a metallic glass having a glass transition temperature of less than or equal to about 600° C. and a supercooled liquid region of greater than or equal to 0 K, and an organic vehicle, and an electronic device and a solar cell include an electrode formed using the conductive paste.