公开(公告)号：US20180136713A1

公开(公告)日：2018-05-17

申请号：US15814790

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaecheol Kim ,  Jinkyu Kim ,  Dongwoo Kim ,  Jeongho Kim ,  Jaesoo Chaung ,  Jongshik Ha ,  Heetae Oh ,  Hyeokseon Yu ,  Seungyoung Lee ,  Wooyoung Choi ,  Jaewoong Han ,  Mangun Hur

IPC: G06F1/32 ,  G06F15/78 ,  H03F3/217

Abstract: An electronic device includes a system-on-chip (SoC) including at least one component, a memory, and a processor functionally connected to the SoC and the memory. The processor is configured to apply a default voltage for driving the at least one component at a specific frequency. The processor is also configured to determine whether data on an offset voltage corresponding to the at least one component and the specific frequency is stored. The processor is further configured to apply the offset voltage, being different from the default voltage, to the at least one component when the data on the offset voltage is stored. Other embodiments are possible.

公开(公告)号：US11456273B2

公开(公告)日：2022-09-27

申请号：US16682840

申请日：2019-11-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaecheol Kim ,  Gilman Kang ,  Yongdae Ha

IPC: B23K20/00 ,  H01L23/00 ,  B23K20/02 ,  B23K101/40

Abstract: A bonding head for performing a thermal compression process including a base body. A bonding heater is disposed on the base body that generates a melting heat. A bonding tool is disposed on the bonding heater that compresses a bonding object against a bonding base while transferring the melting heat to the bonding object to thereby bond the bonding object to the bonding base by the thermal compression process. A heat controller is disposed at the bonding tool, and a thermal conductivity of the heat controller is less than a thermal conductivity of the bonding tool.

公开(公告)号：US10579131B2

公开(公告)日：2020-03-03

申请号：US15814790

申请日：2017-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaecheol Kim ,  Jinkyu Kim ,  Dongwoo Kim ,  Jeongho Kim ,  Jaesoo Chaung ,  Jongshik Ha ,  Heetae Oh ,  Hyeokseon Yu ,  Seungyoung Lee ,  Wooyoung Choi ,  Jaewoong Han ,  Mangun Hur

IPC: G06F1/26 ,  G06F1/32 ,  G06F1/3296 ,  G06F1/3206 ,  G06F15/78 ,  H03F3/217

Abstract: An electronic device includes a system-on-chip (SoC) including at least one component, a memory, and a processor functionally connected to the SoC and the memory. The processor is configured to apply a default voltage for driving the at least one component at a specific frequency. The processor is also configured to determine whether data on an offset voltage corresponding to the at least one component and the specific frequency is stored. The processor is further configured to apply the offset voltage, being different from the default voltage, to the at least one component when the data on the offset voltage is stored. Other embodiments are possible.