公开(公告)号：US20190198342A1

公开(公告)日：2019-06-27

申请号：US16233399

申请日：2018-12-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANG-SHIN JANG ,  JONG-MIN BAEK ,  HOON-SEOK SEO ,  EUI-BOK LEE ,  SUNG-JIN KANG ,  VIETHA NGUYEN ,  DEOK-YOUNG JUNG ,  SANG-HOON AHN ,  HYEOK-SANG OH ,  WOO-KYUNG YOU

IPC: H01L21/308 ,  H01L21/02 ,  G03F7/20 ,  G03F7/11

CPC classification number: H01L21/3086 ,  G03F7/11 ,  G03F7/70033 ,  H01J37/32 ,  H01L21/02274 ,  H01L21/0228 ,  H01L21/02304 ,  H01L21/3081 ,  H01L21/3085

Abstract: Provided herein is a method of forming micropatterns, including: forming an etching target film on a substrate; forming a photosensitivity assisting layer on the etching target film, the photosensitivity assisting layer being terminated with a hydrophilic group; forming an adhesive layer on the photosensitivity assisting layer, the adhesive layer forming a covalent bond with the hydrophilic group; forming a hydrophobic photoresist film on the adhesive layer; and patterning the photoresist film.