公开(公告)号：US20170123173A1

公开(公告)日：2017-05-04

申请号：US15257038

申请日：2016-09-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho-chul Ji ,  Keun-yeong CHO ,  In-sung JOE

IPC: G02B6/42 ,  G02B6/12

CPC classification number: G02B6/4251 ,  G02B6/12004 ,  G02B6/34 ,  G02B6/4214 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4292 ,  H01L2224/16225

Abstract: An optical integrated circuit (IC) package includes an optical IC including an optical IC substrate, an optical IC including an optical IC substrate, an electrical integrated circuit device (EICD) on the optical IC substrate, at least one optical device spaced apart from the EICD on the optical IC substrate, an optical interface on a first side of the optical IC substrate, an electrical interface located on a second side of the optical IC substrate, and an encapsulation member configured to encapsulate the optical IC, the EICD, the at least one optical device, the optical interface, and the electrical interface.

公开(公告)号：US20190288485A1

公开(公告)日：2019-09-19

申请号：US16431344

申请日：2019-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-jae SHIN ,  Dong-hyun KIM ,  Seong-gu KIM ,  In-sung JOE ,  Kyoung-ho HA

IPC: H01S5/20 ,  G02B6/12 ,  H01S5/10

Abstract: Hybrid silicon lasers are provided including a bulk silicon substrate, a localized insulating layer that extends on at least a portion of the bulk silicon substrate, an optical waveguide structure on an upper surface of the localized insulating layer. The optical waveguide structure includes an optical waveguide including a silicon layer. A lasing structure is provided on the optical waveguide structure.