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    AIR CONDITIONER
    3.
    发明申请
    AIR CONDITIONER 有权

    公开(公告)号：US20240401820A1

    公开(公告)日：2024-12-05

    申请号：US18635643

    申请日：2024-04-15

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seonuk NA ,  Kyunghoon Kim ,  Sunggoo Kim ,  Hyunah Kim ,  Hyeongjoon Seo ,  Kisup Lee

    IPC: F24F1/028 ,  F24F7/013 ,  F24F11/00 ,  F24F11/77 ,  F24F12/00 ,  F24F110/40

    Abstract: An air conditioner includes: a housing, an indoor air inlet configured to draw in indoor air, and an outlet to discharge air introduced into the outdoor air inlet and the indoor air inlet; a blower fan to generate an air flow; a total heat exchanger in the housing and to exchange heat; a compressor in the housing and to compress a refrigerant; a condenser to condense the refrigerant as compressed by the compressor; an expansion device to expand the refrigerant as condensed in the condenser; and an evaporator to evaporate the refrigerant as discharged from the expansion device, wherein the outlet includes: a first outlet to discharge the outdoor air, which passes through the total heat exchanger and the evaporator, into an indoors; and a second outlet to discharge the indoor air, which passes through the condenser, to the outdoors.

    Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure
    5.
    发明授权
    Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure 有权

    公开(公告)号：US12014977B2

    公开(公告)日：2024-06-18

    申请号：US18199824

    申请日：2023-05-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ji-Seok Hong ,  Dongwoo Kim ,  Hyunah Kim ,  Un-Byoung Kang ,  Chungsun Lee

    IPC: H01L21/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/498

    CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822

    Abstract: Disclosed are interconnection structures, semiconductor packages including the same, and methods of fabricating the same. The interconnection structure comprises a first dielectric layer, a wiring pattern formed in the first dielectric layer, a portion of the wiring pattern exposed with respect to a top surface of the first dielectric layer, a second dielectric layer on the first dielectric layer, the second dielectric layer including an opening that exposes the exposed portion of the wiring pattern, a pad formed in the opening of the second dielectric layer, the pad including a base part that covers the exposed portion of the wiring pattern at a bottom of the opening and a sidewall part that extends upwardly along an inner lateral surface of the opening from the base part, a first seed layer interposed between the second dielectric layer and a first lateral surface of the sidewall part, the first seed layer being in contact with the first lateral surface and the second dielectric layer, and a second seed layer that conformally covers a second lateral surface of the sidewall part and a top surface of the base part, the second lateral surface being opposite to the first lateral surface the second dielectric layer.

    Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure
    6.
    发明授权
    Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure 有权

    公开(公告)号：US11688679B2

    公开(公告)日：2023-06-27

    申请号：US17324569

    申请日：2021-05-19

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ji-Seok Hong ,  Dongwoo Kim ,  Hyunah Kim ,  Un-Byoung Kang ,  Chungsun Lee

    IPC: H01L23/48 ,  H01L23/498 ,  H01L21/48 ,  H01L23/31

    CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822

    Abstract: Disclosed are interconnection structures, semiconductor packages including the same, and methods of fabricating the same. The interconnection structure comprises a first dielectric layer, a wiring pattern formed in the first dielectric layer, a portion of the wiring pattern exposed with respect to a top surface of the first dielectric layer, a second dielectric layer on the first dielectric layer, the second dielectric layer including an opening that exposes the exposed portion of the wiring pattern, a pad formed in the opening of the second dielectric layer, the pad including a base part that covers the exposed portion of the wiring pattern at a bottom of the opening and a sidewall part that extends upwardly along an inner lateral surface of the opening from the base part, a first seed layer interposed between the second dielectric layer and a first lateral surface of the sidewall part, the first seed layer being in contact with the first lateral surface and the second dielectric layer, and a second seed layer that conformally covers a second lateral surface of the sidewall part and a top surface of the base part, the second lateral surface being opposite to the first lateral surface the second dielectric layer.

    Buried type air purifier
    7.
    发明授权
    Buried type air purifier 有权

    公开(公告)号：US12298036B2

    公开(公告)日：2025-05-13

    申请号：US17867916

    申请日：2022-07-19

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seonuk Na ,  Hyunah Kim ,  Jaehyoung Sim ,  Eomji Jang ,  Sungjune Cho ,  Hyungmo Koo ,  Joonhyoung Kim

    IPC: B01D46/10 ,  B01D46/00 ,  F24F8/10 ,  F24F13/14 ,  F24F13/20

    Abstract: A buried type air purifier including a main body to be buried in a buried space through a buried opening provided on a boundary surface between a use space and the buried space, the main body having an intake passage and a discharge passage which take in and discharge air, respectively; a fan to guide air of the use space along the intake passage and the discharge passage; and a filter to filter the air. The main body includes: a first main body part having a fan accommodating part to accommodate the fan; and a second main body part having a cross sectional area, which is parallel with the boundary surface, being smaller than the first main body part, where the second main body part is formed to pass the intake and discharge passages through which the air guided via the fan accommodated in the fan accommodating part passes.

    Substrate debonding apparatus
    8.
    发明授权
    Substrate debonding apparatus 有权

    公开(公告)号：US12205832B2

    公开(公告)日：2025-01-21

    申请号：US17718635

    申请日：2022-04-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jonghyeon Chang ,  Hyunah Kim ,  Younghyun You ,  Younghwan Jin ,  Junho Choi

    IPC: H01L21/67 ,  H01L21/687

    Abstract: A substrate debonding apparatus includes a chuck attached to a second surface opposite to the first surface of the semiconductor substrate via a second adhesive layer. The chuck is configured to support a lower portion of a base film having a cross-sectional area in a horizontal direction greater than a cross-sectional area of the semiconductor substrate in the horizontal direction. The semiconductor debonding apparatus further includes a fixing ring arranged above the chuck and configured to fix in position an edge portion of the base film, and a cover ring arranged above the fixing ring and configured to adjust a diameter of an opening exposing the carrier substrate. The cover ring includes a guide frame arranged above the fixing ring, and a plurality of cover blades configured to move in a horizontal direction determined by the guide frame.

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