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    Thickness prediction network learning method, semiconductor device manufacturing method, and semiconductor material deposition equipment
    1.
    发明授权
    Thickness prediction network learning method, semiconductor device manufacturing method, and semiconductor material deposition equipment 有权

    公开(公告)号：US11494642B2

    公开(公告)日：2022-11-08

    申请号：US16678755

    申请日：2019-11-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Su-il Cho ,  Sung-yoon Ryu ,  Yu-sin Yang ,  Chi-hoon Lee ,  Hyun-su Kwak ,  Jung-won Kim

    IPC: G06N3/08 ,  C23C16/52 ,  H01L27/115 ,  H01L21/66

    Abstract: A thickness prediction network learning method includes measuring spectrums of optical characteristics of a plurality of semiconductor structures each including a substrate and first and second semiconductor material layers alternately stacked thereon to generate sets of spectrum measurement data, measuring thicknesses of the first and second semiconductor material layers to generate sets of thickness data, training a simulation network using the sets of spectrum measurement data and the sets of thickness data, generating sets of spectrum simulation data of spectrums of the optical characteristics of a plurality of virtual semiconductor structures based on thicknesses of first and second virtual semiconductor material layers using the simulation network, each of the first and second virtual semiconductor layers including the same material as the first and second semiconductor material layers, respectively; and training a thickness prediction network by using the sets of spectrum measurement data and the sets of spectrum simulation data.

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