公开(公告)号：US20170183401A1

公开(公告)日：2017-06-29

申请号：US15387198

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongseok Jo ,  Sang Yeul Han ,  Joo-Hye Song ,  Yuhoi Kang ,  Young Jun Koh ,  Sang Chul Park ,  Hojun Lee

IPC: C07K16/22

CPC classification number: C07K16/22 ,  A61K2039/505 ,  A61K2039/545 ,  C07K2317/20 ,  C07K2317/24 ,  C07K2317/34 ,  C07K2317/565 ,  C07K2317/622 ,  C07K2317/92

Abstract: Provided is a method of decreasing blood sugar level or preventing and/or treating a hyperglycemia-related disease, including administering an anti-Ang2 antibody or an antigen-biding fragment thereof to a subject in need thereof.

公开(公告)号：US20170183399A1

公开(公告)日：2017-06-29

申请号：US15387282

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yuhoi Kang ,  Hojun Lee ,  Hongseok Jo ,  Sang Chul Park ,  Sang Yeul Han

IPC: C07K16/18

CPC classification number: C07K16/18 ,  A61K2039/505 ,  C07K16/22 ,  C07K2317/21 ,  C07K2317/24 ,  C07K2317/565 ,  C07K2317/622 ,  C07K2317/74 ,  C07K2317/75 ,  C07K2317/92

Abstract: Provided is a method of potentiating immunity or preventing or treating an immune-related disease comprising administering an anti-Ang2 antibody or an antigen-binding fragment thereof to a subject in need thereof.

公开(公告)号：US20160113890A1

公开(公告)日：2016-04-28

申请号：US14836503

申请日：2015-08-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjun Koh ,  Sangchul Park ,  Sungchun Cho ,  Hongseok Jo

IPC: A61K31/136

CPC classification number: A61K31/136 ,  A61K31/145 ,  A61K31/167

Abstract: A method of stimulating neovascularization at a site in a subject, or preventing or treating symptoms related to a decrease in vascularization in a subject, the method including administering dapsone or N-acetyl-dapsone, its pharmaceutically acceptable salt, a solvate, a polymorph, or a combination thereof to the subject; as well as related methods and compositions.

Abstract translation: 刺激受试者的部位的新生血管形成或预防或治疗与受试者血管形成减少有关的症状的方法，所述方法包括施用氨苯砜或N-乙酰基氨苯砜，其药学上可接受的盐，溶剂合物，多晶型物， 或其组合; 以及相关方法和组成。