公开(公告)号：US20240032287A1

公开(公告)日：2024-01-25

申请号：US18344077

申请日：2023-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eunjung KIM ,  Jaehyung PARK ,  Kihyung NAM ,  Hoju SONG ,  Yunjae LEE

IPC: H10B12/00

CPC classification number: H10B12/50 ,  H10B12/488 ,  H10B12/482 ,  H10B12/09

Abstract: A semiconductor device including a substrate including a cell array region and a peripheral circuit region, the substrate including first active region defined in the cell array region and second active region defined in the peripheral circuit region, a plurality of word lines in the substrate and extending in a first direction, a bit line in the cell array region and extending in a second direction perpendicular to the first direction, a plurality of first pad separation patterns on corresponding once of the word lines, respectively, and extending in the first direction, a cell pad structure on the substrate and between two adjacent ones of the first pad separation patterns, and a second pad separation pattern between two adjacent ones of the first pad separation patterns and being adjacent to the cell pad structure may be provided.