公开(公告)号：US20220338711A1

公开(公告)日：2022-10-27

申请号：US17560677

申请日：2021-12-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heemoon JEONG ,  Minsoo KIM ,  Joongwon NA ,  Kookjeong SEO

IPC: A47L23/20 ,  A47L23/18

Abstract: A shoe care apparatus includes a main body, a care room provided in the main body and configured to accommodate shoes, a machine room in the main body and configured to accommodate a heat pump device including an evaporator and a condenser, and a blower fan configured to allow air circulating through the care room and the machine room to be blown. The show care apparatus further includes a first circulation passage through which air discharged from the care room is supplied to the care room by passing through the evaporator and the condenser and a second circulation passage through which air discharged from the care room is supplied to the care room by passing through the evaporator and bypassing the condenser. The shoe care apparatus also including a first damper configured to open and close the second circulation passage.

公开(公告)号：US20250102197A1

公开(公告)日：2025-03-27

申请号：US18893178

申请日：2024-09-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehwan LEE ,  Haejin SONG ,  Heemoon JEONG

IPC: F25B21/02

Abstract: A refrigerator including an inner case having an inner case opening, an outer case having an outer case opening, a mounting frame having a passage between the inner case opening and the outer case opening, an insulation in an insulating space where one end of the passage of the mounting frame is at the inner case opening of the inner case and another end of passage of the mounting frame is at the outer case opening, a thermoelectric element including a heat-absorbing surface and a heat-generating surface, a cooling sink in contact with the heat-absorbing surface so as to exchange heat with the heat-absorbing surface, and a heat sink in contact with the heat-generating surface so as to exchange heat with the heat-generating surface, wherein the cooling sink and the heat sink are respectively coupled to the mounting frame.

公开(公告)号：US20220163244A1

公开(公告)日：2022-05-26

申请号：US17536578

申请日：2021-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungwook BAE ,  Seulki MIN ,  Kookjeong SEO ,  Wonjae Yoon ,  Heemoon JEONG

IPC: F25B41/20 ,  F25B41/37 ,  F16K11/074

Abstract: A valve device comprises a case comprising an open lower portion and an accommodation space formed therein, a base plate to cover the open lower portion of the case, an inlet pipe connected to the base plate and through which a refrigerant is introduced to the accommodation space, a boss installed to the base plate and comprising a plurality of refrigerant inlet and outlet holes through which the introduced refrigerant from the accommodation space is introduced and discharged, a plurality of inlet and outlet pipes respectively connected to the plurality of refrigerant inlet and outlet holes, and through which the refrigerant is introduced from the boss or discharged to the boss, and a pad comprising an open cavity formed therein to selectively open one refrigerant inlet and outlet hole, and a connection cavity formed therein to selectively connect two refrigerant inlet and outlet holes.

公开(公告)号：US20250137694A1

公开(公告)日：2025-05-01

申请号：US18929801

申请日：2024-10-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehwan LEE ,  Haejin SONG ,  Heemoon JEONG

IPC: F25B21/02 ,  F25D11/02 ,  F25D19/00 ,  F25D23/06

Abstract: A refrigerator may include a body including an insulating wall having a hole, a compartment in the body, and a thermoelectric module in the hole and configured to cool the compartment the thermoelectric module includes a thermoelectric element including: a heat-absorbing surface on a first side facing and configured to absorb heat from the compartment, a heat-generating surface on a second side, opposite the first side, and configured to receive heat from the heat-absorbing surface and discharge the received heat, a cooling sink in contact with the heat-absorbing surface and configured to exchange heat with the heat-absorbing surface, a heat sink in contact with the heat-generating surface and configured to exchange heat with the heat-generating surface, and a coupling member coupling the cooling sink and heat sink so that the cooling sink is pressed against the heat-absorbing surface and the heat sink is pressed against the heat-generating surface.

公开(公告)号：US20230190074A1

公开(公告)日：2023-06-22

申请号：US18113435

申请日：2023-02-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heemoon JEONG ,  Minsoo KIM ,  Joongwon NA ,  Judai KIM ,  Kookjeong SEO

IPC: A47L23/20 ,  F25B49/02 ,  A47B61/04 ,  A61L9/20 ,  A61L9/12 ,  A61L9/04 ,  A61L9/14

CPC classification number: A47L23/20 ,  F25B49/022 ,  A47B61/04 ,  A61L9/20 ,  A61L9/122 ,  A61L9/046 ,  A61L9/14 ,  F25B2600/0253 ,  F25B2700/151 ,  F25B2700/2104 ,  F25B2700/21172 ,  A61L2209/111 ,  A61L2209/212 ,  A61L2209/13

Abstract: A shoe care apparatus including a chamber including an air inlet and an air outlet; a first duct connected to the air outlet and having an evaporator and a condenser arranged inside; a second duct connected to the first duct and the air inlet; a holder arranged in the chamber and connected to the air inlet; a fan configured to circulate air through the first duct, the second duct, the holder, the chamber; a compressor configured to discharge a refrigerant to the condenser; a first temperature sensor configured to measure a first temperature of air heated by the condenser; and a controller configured to determine a target temperature of the heated air based on the user input, operate the compressor at the operation frequency based on the target temperature and outside air temperature, and control the operation frequency of the compressor based on the target temperature and the first temperature.

公开(公告)号：US20230097656A1

公开(公告)日：2023-03-30

申请号：US17876154

申请日：2022-07-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seulki MIN ,  Kookjeong SEO ,  Heemoon JEONG ,  Insub LEE

IPC: F16K11/074 ,  F25B41/20 ,  F25B41/37 ,  F16K31/53

Abstract: A valve device includes a case including an open lower portion and an accommodation space provided therein, a base plate to cover the open lower portion of the case, a refrigerant inlet pipe connected to the base plate and to allow a refrigerant to flow into the accommodation space, an inlet and outlet pipe connected to the base plate to allow the refrigerant to flow in and out, a boss including a refrigerant inlet and outlet hole formed at a first position spaced apart from a center to communicate with the inlet and outlet pipe, and an extending groove extending radially outward from the first position to a second position and connected to the refrigerant inlet and outlet hole, and a pad including an open cavity rotatable on one side of the boss to close the refrigerant inlet and outlet hole and to open the extending groove.

公开(公告)号：US20220163129A1

公开(公告)日：2022-05-26

申请号：US17536584

申请日：2021-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jungwook BAE ,  Kookjeong SEO ,  Heemoon JEONG

IPC: F16K27/02 ,  F16K31/53 ,  F16K31/04

Abstract: A valve device includes a case having an opened bottom portion and a receiving space formed therein, a base plate covering the open bottom of the case, a flow-in pipe coupled to the base plate to bring in a refrigerant, a boss installed to the base plate and including a plurality of refrigerant flow-in/out holes through which the introduced refrigerant flows in/out, a plurality of flow-in/out pipes coupled to the plurality of refrigerant flow-in/out holes and through which the introduced refrigerant flows in/out, and a pad arranged on the boss and including an open cavity formed therein to selectively opening one of the plurality of refrigerant flow-in/out holes and a connection cavity formed therein to selectively connecting two of the plurality of refrigerant flow-in/out holes.

公开(公告)号：US20240125525A1

公开(公告)日：2024-04-18

申请号：US18230961

申请日：2023-08-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seulki MIN ,  Heemoon JEONG ,  Gaeul CHO ,  Kookjeong SEO ,  Insub LEE

IPC: F25B41/20 ,  F25B5/02 ,  F25B41/37

CPC classification number: F25B41/20 ,  F25B5/02 ,  F25B41/37 ,  F25B2500/24 ,  F25B2500/26 ,  F25B2600/0253 ,  F25B2600/2511 ,  F25B2700/02 ,  F25B2700/2106

Abstract: A refrigerator includes: a compressor; a condenser; a hot pipe; at least one capillary tube; at least one evaporator; a valve device including: an input port connected to the condenser; a first port connected to one end of the hot pipe; a second port connected to an other end; and at least one output port connected to the at least one capillary tube; and a controller configured to: control the valve device to operate in the first mode by connecting one of the first port and the second port to the input port and connecting an other one to the output port; control the valve device to operate in the second mode, by closing one of the first port and the second port and connecting an other one to the output port; and control the valve device to operate in the third mode, by closing all the first port and the second port.

公开(公告)号：US20240122442A1

公开(公告)日：2024-04-18

申请号：US18534213

申请日：2023-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Joongwon NA ,  Minsoo KIM ,  Heemoon JEONG ,  Kookjeong SEO

IPC: A47L23/20 ,  A47L23/18

CPC classification number: A47L23/205 ,  A47L23/18

Abstract: The present disclosure relates to a shoe care apparatus including: a main body, a care room provided in the main body configured to accommodate shoes, a machine room provided in the main body configured to accommodate a heat pump device including an evaporator and a condenser, a circulation flow path configured to communicate with the care room so that air discharged from the care room passes through the evaporator and the condenser and is supplied to the care room, a first blower fan disposed on the circulation flow path configured to blow air in the circulation flow path in a first direction so that the air in the circulation flow path passes through the machine room from the care room and circulates back to the care room, and a second blower fan disposed in the machine room configured to blow air in the machine room in a second direction so that the air in the machine room passes through the condenser.

公开(公告)号：US20240011691A1

公开(公告)日：2024-01-11

申请号：US18372464

申请日：2023-09-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minsoo KIM ,  Joongwon NA ,  Heemoon JEONG ,  Kookjeong SEO

IPC: F25B49/02 ,  F25B30/02 ,  A47L23/20 ,  A61L9/20 ,  A47B81/00

CPC classification number: F25B49/025 ,  F25B30/02 ,  A47L23/205 ,  A61L9/20 ,  A47B81/00 ,  F25B2600/111 ,  F25B2600/0251 ,  F25B2700/21161 ,  F25B2700/21174 ,  A61L2209/11

Abstract: A shoe care apparatus according to one aspect includes a chamber for accommodating shoes; a heat pump device including a condenser for heating air to be supplied to the chamber, and a compressor for discharging a coolant to the condenser; a fan for supplying the heated air to the chamber; a temperature sensor for acquiring the temperature of the air to be supplied to the chamber; and a controller. The controller performs a synchronous operation mode controlling the compressor and the fan to operate together, based on receipt of a signal from the temperature sensor, and performs an asynchronous operation mode in which the fan is operated without operating the compressor in response to a predetermined time period having elapsed after the stop of the operation of the compressor.