公开(公告)号：US20210321185A1

公开(公告)日：2021-10-14

申请号：US17250590

申请日：2019-08-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinwoo KIM ,  Sujin JUNG ,  Hakrae KANG ,  Heejun PARK ,  Minseok SHIN ,  Changhwan LEE

IPC: H04R1/04 ,  H05K5/00

Abstract: According to an embodiment of the present invention, an electronic device may comprise: a housing; a printed circuit board disposed inside the housing, the printed circuit board comprising a first surface, a second surface facing away from the first surface, and a first through-hole and a second through-hole penetrating the first surface and the second surface; a first microphone disposed on the second surface so as to at least partially overlap the first through-hole when seen from above the first surface; a second microphone disposed on the second surface so as to at least partially overlap the second through-hole when seen from above the first surface; a support member disposed on the first surface, the support member comprising a third surface facing the first surface, a fourth surface facing away from the third surface, a third through-hole at least partially overlapping the first through-hole when seen from above the first surface, and a fourth through-hole at least partially overlapping the second through-hole when seen from above the first surface; a first sound-transmitting member disposed on the fourth surface so as to at least partially overlap the third through-hole; and a second sound-transmitting member disposed on the fourth surface so as to at least partially overlap the fourth through-hole. Various other embodiments may be included.

公开(公告)号：US20230052402A1

公开(公告)日：2023-02-16

申请号：US17976355

申请日：2022-10-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungkwon CHOI ,  Hakrae KANG ,  Jinwoo KIM

IPC: H04R1/28 ,  H05K5/02 ,  H04M1/03

Abstract: An electronic device is provided. The electronic device includes a first frame including a first surface, a second surface facing the direction opposite to that of the first surface, and a side surface encompassing the space between the first surface and the second surface, a guide path which is formed in the space of the first frame and which includes, from the side surface toward the space, an external environment connection hole formed at a specified depth, a first through-hole formed from the second surface up to the external environment connection hole, and a second through-hole formed at a location apart from the first through-hole so as to be formed from the first surface up to the second surface, and a sealing member including a sound module disposed on the first surface so as to correspond to the second through-hole, and a recess which is disposed on the second surface and connects the first through-hole to the second through-hole.