公开(公告)号：US20240290812A1

公开(公告)日：2024-08-29

申请号：US18504674

申请日：2023-11-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： SEUNGKUK KANG ,  TAEYON LEE ,  HYO EUN KIM ,  Gyuseok LEE

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14634 ,  H01L27/1469

Abstract: An image sensor comprising a circuit chip and an image sensor chip on the circuit chip. The image sensor chip includes a first substrate extending in a first direction and a second direction, a first interlayer dielectric layer between the first substrate and the circuit chip, and a first bonding pad in the first interlayer dielectric layer and having a first width in a first direction. The circuit chip includes a second substrate, a second interlayer dielectric layer and a third interlayer dielectric layer that are sequentially stacked on the second substrate, and a second bonding pad in the second and third interlayer dielectric layers and having a second width in the first direction. The first and second bonding pads are in contact with each other. A change in the second width along a third direction is greater than a change in the first width along the third direction, the third direction intersects the first and second directions.