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公开(公告)号：US20230253388A1
公开(公告)日：2023-08-10
申请号：US18134908
申请日：2023-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changkyu CHUNG , Gyun HEO , Tackmo LEE , Kyungwoon JANG , Soonmin HONG , Daesuck HWANG
CPC classification number: H01L25/167 , H01L33/62 , G09G3/32 , G09G2300/026 , G09G2300/0842 , G09G2300/0426 , G09G2300/0452
Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.
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公开(公告)号：US20230223388A1
公开(公告)日：2023-07-13
申请号：US18121939
申请日：2023-03-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changkyu CHUNG , Tackmo LEE , Kyungwoon JANG , Gyun HEO , Soonmin HONG , Daesuck HWANG
IPC: H01L25/16 , H01L25/075
CPC classification number: H01L25/167 , H01L25/0753
Abstract: A display module including a plurality of pixels, according to an embodiment, may include: a first substrate: a plurality of inorganic light-emitting elements disposed on the upper surface of the first substrate; a plurality of micro pixel controllers disposed on the lower surface of the first substrate; and a driver IC which transmits driving signals to the plurality of micro pixel controllers, wherein each of the plurality of pixels includes two or more inorganic light-emitting elements among the plurality of inorganic light-emitting elements, and each of the plurality of micro pixel controllers controls two or more pixels among the plurality of pixels.
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公开(公告)号：US20230170355A1
公开(公告)日：2023-06-01
申请号：US18102375
申请日：2023-01-27
Applicant: SAMSUNG ELECTRONICS CO., LTD. , ENJET CO., LTD.
Inventor： Doyoung BYUN , Yonghee JANG , Keon KUK , Seongyong KIM , Jinwoo JUNG , Soonmin HONG , Tackmo LEE , Gyun HEO
CPC classification number: H01L27/124 , H01L25/167 , H01L27/1288
Abstract: A display module includes a thin film transistor (TFT) substrate including a class substrate and a TFT layer provided on a front surface of the glass substrate, the TFT layer including a TFT circuit, a plurality of light emitting diodes provided on the TFT layer, a plurality of first connection pads provided at a distance from each other on the front surface of the glass substrate and connected to the TFT circuit, a plurality of second connection pads provided at a distance from each other on a rear surface of the glass substrate and connected to a second circuit, where the second circuit is configured to supply power and is connected to a control board, and a plurality of side wirings electrically connecting each of the plurality of first connection pads to respective connection pads of the plurality of second connection pads.
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公开(公告)号：US20210135076A1
公开(公告)日：2021-05-06
申请号：US17259681
申请日：2019-07-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki JUNG , Jinho KIM , Dongmyung SON , Sangmin SHIN , Changjoon LEE , Kyungwoon JANG , Seongphil CHO , Gyun HEO , Soonmin HONG
IPC: H01L33/62
Abstract: A display panel is disclosed. The disclosed display panel includes a thin film transistor substrate, a plurality of micro LEDs arranged on one surface of the thin film transistor substrate, a plurality of first connection pads disposed on the one surface of the thin film transistor substrate, a plurality of second connection pads disposed on the other surface of the thin film transistor substrate that faces the one surface, and a plurality of connection wirings disposed on a side surface of the thin film transistor substrate for electrically connecting each of the plurality of first connection pads and the plurality of second connection pads, wherein at least one of an edge region on the one surface and an edge region on the other surface of the thin film transistor substrate includes a cutting area which is cut in an inward direction of the thin film transistor substrate.
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公开(公告)号：US20220149112A1
公开(公告)日：2022-05-12
申请号：US17524421
申请日：2021-11-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Daesuck HWANG , Kyungwoon JANG , Changkyu CHUNG , Gyun HEO , Soonmin HONG
Abstract: A display module and a display apparatus including the same are provided. The display module includes a first substrate; a plurality of micro-pixel controllers provided on an upper surface of the first substrate and including a second substrate; a plurality of pixels including a plurality of inorganic light emitting diodes (LEDs) provided on an upper surface of the second substrate; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein each pixel of the plurality of pixels includes at least two inorganic LEDs among the plurality of inorganic LEDs, and wherein each micro-pixel controller of the plurality of micro-pixel controllers is electrically connected to inorganic LEDs of at least two pixels.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20200152721A1
公开(公告)日：2020-05-14
申请号：US16680764
申请日：2019-11-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changkyu CHUNG , Changjoon LEE , Kyungwoon JANG , Gyun HEO , Youngjun MOON , Kwangrae JO , Soonmin HONG , Daesuck HWANG
Abstract: A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.
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公开(公告)号：US20210375833A1
公开(公告)日：2021-12-02
申请号：US16629768
申请日：2018-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngchul LEE , Taesang PARK , Kyoree LEE , Tackmo LEE , Gyun HEO , Youngjun MOON , Won CHOI
IPC: H01L25/075 , H01L33/62 , H01L33/00 , H01L25/16
Abstract: The disclosure describes a micro Light Emitting Diode (LED) display. The display may include a Printed Circuit Board (PCB) including a plurality of solder pads, a micro LED package including a plurality of micro LED chips, and a plurality of solder electrodes which bond the micro LED chips onto the solder pads of the PCB. The micro LED package may be re-arranged in an Red Green Blue (RGB) state on a temporary fixing film by using a pickup device in accordance with a display pixel configuration, after the micro LED chips are attached to a carrier film.
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公开(公告)号：US20210351205A1
公开(公告)日：2021-11-11
申请号：US17383992
申请日：2021-07-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwoon JANG , Wonsoon PARK , Dongmyung SON , Sangmin SHIN , Changjoon LEE , Youngki JUNG , Seongphil CHO , Gyun HEO , Soonmin HONG
Abstract: A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.
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9.发明申请公开(公告)号：US20200259056A1
公开(公告)日：2020-08-13
申请号：US16786514
申请日：2020-02-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonmin HONG , Gyuhwa KIM , Jeonggen YOON , Tackmo LEE , Gyun HEO , Youngjun MOON , Kyungwoon JANG
Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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公开(公告)号：US20200013803A1
公开(公告)日：2020-01-09
申请号：US16503035
申请日：2019-07-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kyungwoon JANG , Wonsoon PARK , Dongmyung SON , Sangmin SHIN , Changjoon LEE , Youngki JUNG , Seongphil CHO , Gyun HEO , Soonmin HONG
Abstract: A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.
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