公开(公告)号：US20220093405A1

公开(公告)日：2022-03-24

申请号：US17544990

申请日：2021-12-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin SHIN ,  Woo-Mok SON ,  Nam-Hoon LEE ,  Dong-Eog KIM ,  Seung-Hun OH ,  Eun-Seok LEE ,  Young-Seok JANG

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/66

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

公开(公告)号：US20200152469A1

公开(公告)日：2020-05-14

申请号：US16426117

申请日：2019-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin SHIN ,  Woo-Mok SON ,  Nam-Hoon LEE ,  Dong-Eog KIM ,  Seung-Hun OH ,  Eun-Seok LEE ,  Young-Seok JANG

IPC: H01L21/304 ,  H01L21/02 ,  H01L21/66

Abstract: In a method of manufacture, a displacement sensor is provided over a conditioner disk. The conditioner disk is rotated to perform a conditioning process on a polishing surface of a polishing pad. A displacement of the rotating conditioner disk is detected using the displacement sensor during the conditioning process. A height of the conditioner disk is calculated from the detected displacement. An end point of the conditioning process is determined on the polishing surface based on the calculated height.

公开(公告)号：US20150116698A1

公开(公告)日：2015-04-30

申请号：US14460814

申请日：2014-08-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung-Bok KANG ,  Seok-Min KANG ,  Bon-Ok KOO ,  Kyoung-Hwan KIM ,  Myung-Woo KIM ,  In-Gi KIM ,  Hyun-Chul KIM ,  Sung-Ki ROH ,  Gyung-Jin MIN ,  Eun-Seok LEE ,  Jin-Suk HONG

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9501 ,  G01N21/8851 ,  G01N2021/8887

Abstract: In a method of inspecting a surface of a substrate, a first surface image of the substrate before loaded into a process chamber may be obtained. The first surface image may be processed to detect a defect on the surface of the substrate. Thus, the surfaces of all of the substrate may be inspected during a process may be performed without transferring the substrates.

Abstract translation: 在检查基板的表面的方法中，可以获得在加载到处理室之前的基板的第一表面图像。 可以处理第一表面图像以检测基板表面上的缺陷。 因此，可以在不转移基板的情况下执行处理期间所有基板的表面。