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公开(公告)号：US20240356208A1
公开(公告)日：2024-10-24
申请号：US18371174
申请日：2023-09-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Doohyun Yang , Dooseok Choi , Youngki Lee , Seungyoon Jung , Woncheol Jeong , Dongkwon Choi , Joonhoi Hur
CPC classification number: H01Q1/48 , H01Q1/2283 , H01Q9/0414
Abstract: An antenna module is provided. The antenna module includes: antenna module including: a ground layer; and an antenna structure on the ground layer and including: a plurality of layers including a first layer, a second layer and a third layer, wherein the second layer and the third layer are between the ground layer and the first layer; one or more vias extending through at least a portion of the plurality of layers; a radiating element in the first layer, a first stub in the second layer and extending from the one or more vias; and a second stub in the third layer and extending from the one or more vias.
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公开(公告)号：US20210351797A1
公开(公告)日：2021-11-11
申请号：US17379461
申请日：2021-07-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngmin Kim , Hongjong Park , Daeyoung Yoon , Sunwoo Lee , Youngki Lee , Dooseok Choi
IPC: H04B1/00 , H01L23/498 , H01Q21/00 , H05K1/02
Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.
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公开(公告)号：US12040844B2
公开(公告)日：2024-07-16
申请号：US18055921
申请日：2022-11-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dooseok Choi , Youngki Lee , Joonhoi Hur
CPC classification number: H04B17/12 , H04B17/102
Abstract: A wireless communications device may include a controller configured to, in a calibration mode, obtain a first output value of a first power detector after setting a first power amplifier to a first gain and obtain a second output value of the first power detector after setting the first power amplifier to a second gain, wherein the controller may estimate, in a normal mode, output power of a first antenna from an output value of the first power detector, based on a correction coefficient calculated using the first output value and the second output value.
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公开(公告)号：US11855357B2
公开(公告)日：2023-12-26
申请号：US17881219
申请日：2022-08-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki Lee , Sunwoo Lee , Dooseok Choi
CPC classification number: H01Q21/067 , H01Q5/35 , H01Q5/48 , H01Q21/062
Abstract: An antenna device includes an antenna space, a barrier, a signal processing device, and a feed space. The antenna space includes first and second antennas that transmit/receive first and second radio frequency (RF) signals in different bands. The barrier includes a penetration region, is disposed adjacent to the antenna space, and reflects the first and second RF signals. The signal processing device adjacent to the barrier, includes first and second RF circuits that process the RF signals. The feed space includes first and second feed layers and is disposed adjacent to and stacked on the signal processing device, and adjacent to the barrier. A first feed line connecting the first RF circuit to the first antenna passes through the first feed layer and the penetration region, and a second feed line connecting the second RF circuit to the second antenna passes through the second feed layer and the penetration region.
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公开(公告)号：US11955997B2
公开(公告)日：2024-04-09
申请号：US17379461
申请日：2021-07-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngmin Kim , Hongjong Park , Daeyoung Yoon , Sunwoo Lee , Youngki Lee , Dooseok Choi
IPC: H04B1/00 , H01L23/498 , H01Q21/00 , H05K1/02
CPC classification number: H04B1/005 , H01L23/49822 , H01Q21/0025 , H05K1/0243
Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves through a top surface of the multilayer board. The RF chip, on a bottom surface of the multilayer board, is connected to the antenna and processes an RF signal. The active device array, on the bottom surface of the multilayer board, includes active devices, a first input pin and a first output pin. The first input pin and the first output pin are respectively connected to electrodes of an active device of the active devices. The multilayer board includes a first pattern for a first signal to be provided from the RF chip to the first input pin, and a second pattern for a second signal to be provided from the first output pin to the RF chip.
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Patent Agency Ranking
公开(公告)号：US11843190B2
公开(公告)日：2023-12-12
申请号：US17833378
申请日：2022-06-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki Lee , Sunwoo Lee , Dooseok Choi , Seungchan Heo
CPC classification number: H01Q9/045 , H01Q1/38 , H01Q9/0414
Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.
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公开(公告)号：US11462831B2
公开(公告)日：2022-10-04
申请号：US16502241
申请日：2019-07-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dooseok Choi , Youngki Lee , Sunwoo Lee , Thomas Byunghak Cho
IPC: H01Q9/04 , G06K19/077 , H01Q1/22 , H01Q5/28 , H01Q5/40
Abstract: A radio frequency (RF) apparatus includes a radio frequency integrated circuit (RFIC) chip and an antenna module disposed on an upper surface of the RFIC chip. The antenna module includes a first antenna patch that is in parallel with the RFIC chip, the first antenna patch including a first penetration point, and a first power feed point connected to a first power feed line to transmit and receive a first RF signal of a first frequency band; and a second antenna patch disposed above the first antenna patch in parallel with the first antenna patch, the second antenna patch including a second power feed point connected to a second power feed line that penetrates through the first penetration point to transmit and receive a second RF signal of a second frequency band. The first penetration point is formed in a first region of the first antenna patch in which influence on an electric field generated by the first antenna patch via the first power feed point is minimized.
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公开(公告)号：US11329381B2
公开(公告)日：2022-05-10
申请号：US17017133
申请日：2020-09-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Young Ki Lee , Sun Woo Lee , Dooseok Choi
Abstract: An antenna includes a first dielectric substrate and a first feeding element. The first dielectric substrate includes a first insulating layer, and a first radiation plate including a first opening that exposes an upper surface of the first insulating layer. The first feeding element is disposed in the first opening to penetrate the first insulating layer in a direction extending toward a lower surface of the first dielectric substrate. The first feeding element is insulated from the first radiation plate by the first insulating layer. The first feeding element includes a first conductive plate having an upper surface located on a same plane as an upper surface of the first radiation plate.
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公开(公告)号：US20210028797A1
公开(公告)日：2021-01-28
申请号：US16743478
申请日：2020-01-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngmin Kim , Hongjong Park , Daeyoung Yoon , Sunwoo Lee , Youngki Lee , Dooseok Choi
IPC: H04B1/00 , H01Q21/00 , H01L23/498 , H05K1/02
Abstract: An antenna module includes a multilayer board, a radio frequency (RF) chip, and a first active device array. The multilayer board includes an antenna that transmits and receives electromagnetic waves. The RF chip is on a bottom surface of the multilayer board, and includes transmission circuits each of which constitutes a part of each of transmission paths for generating RF signals to be provided to the antenna. The first active device array is on the bottom surface of the multilayer board, and includes a first group of active devices respectively included in a portion of power amplifiers in the transmission paths of the transmission circuits, and first input pins and first output pins respectively connected to electrodes of the first group of active devices.
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公开(公告)号：US12199365B2
公开(公告)日：2025-01-14
申请号：US18387276
申请日：2023-11-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngki Lee , Sunwoo Lee , Dooseok Choi , Seungchan Heo
Abstract: Provided is an antenna module including a plurality of conductive layers stacked in a first direction, the antenna module including a first patch antenna including at least one radiator provided in at least one conductive layer, and an electromagnetic band gap (EBG) structure including a plurality of pillars spaced apart from the at least one radiator in a direction perpendicular to the first direction, the plurality of pillars surrounding the at least one radiator, wherein each of the plurality of pillars includes two or more plates provided parallel with each other in two or more conductive layers, respectively, and at least one via connecting the two or more plates.
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