公开(公告)号：US20150237253A1

公开(公告)日：2015-08-20

申请号：US14582614

申请日：2014-12-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shuichi Shimokawa ,  Dong-min Kim ,  Sang-min Lee ,  Kwi-sung Yoo ,  Seung-hyun Lim ,  Woo-seok Choi ,  Beoung-ouk Min ,  Takafumi Usui

IPC: H04N5/232 ,  H04N5/357 ,  H04N5/378 ,  H04N5/369

CPC classification number: H04N5/23212 ,  H04N5/3456 ,  H04N5/3575 ,  H04N5/369 ,  H04N5/3696 ,  H04N5/378 ,  H04N2101/00

Abstract: A solid-state image sensor of an electronic device includes a plurality of pixels arranged in a matrix form and having a plurality of phase difference pixel of the plurality of pixels. The plurality of phase difference pixels are arranged at locations of pixels that are commonly read out in a plurality of different skip readout modes.

Abstract translation: 电子设备的固态图像传感器包括以矩阵形式排列并具有多个像素的多个相位差像素的多个像素。 多个相位差像素被布置在通常以多个不同的跳过读出模式读出的像素的位置。

公开(公告)号：US09848116B2

公开(公告)日：2017-12-19

申请号：US14582614

申请日：2014-12-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shuichi Shimokawa ,  Dong-min Kim ,  Sang-min Lee ,  Kwi-sung Yoo ,  Seung-hyun Lim ,  Woo-seok Choi ,  Beoung-ouk Min ,  Takafumi Usui

IPC: H04N5/232 ,  H04N5/369 ,  H04N5/357 ,  H04N5/378 ,  H04N101/00

CPC classification number: H04N5/23212 ,  H04N5/3456 ,  H04N5/3575 ,  H04N5/369 ,  H04N5/3696 ,  H04N5/378 ,  H04N2101/00

Abstract: A solid-state image sensor of an electronic device includes a plurality of pixels arranged in a matrix form and having a plurality of phase difference pixel of the plurality of pixels. The plurality of phase difference pixels are arranged at locations of pixels that are commonly read out in a plurality of different skip readout modes.

公开(公告)号：US09553624B2

公开(公告)日：2017-01-24

申请号：US14827244

申请日：2015-08-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae-bum Lee ,  Ki-sun Kim ,  Jong-rak Sohn ,  Seok-chan Lee ,  Dong-min Kim ,  Ju-seok Lee

IPC: G06K19/077 ,  H04B1/3818 ,  H01R13/24 ,  H01R12/70 ,  H01R12/71

CPC classification number: H04B1/3818 ,  G06K19/07741 ,  G06K19/07745 ,  H01R12/7005 ,  H01R12/7076 ,  H01R12/714 ,  H01R13/2442

Abstract: Disclosed are a card socket device and an electronic apparatus including the same. The card socket device includes a seat portion configured to receive an attachable card; and one or more connection terminal portions formed in the seat portion and configured to form an electrical connection with one or more connection pads formed in a bottom surface of the attachable card, wherein the seat portion is configured such that a space accommodating the attachable card is upwardly opened.

Abstract translation: 公开了一种卡插座装置和包括该插座装置的电子设备。 卡插座装置包括配置成接收可附接卡的座部; 以及一个或多个连接端子部分，其形成在所述座部中并且被配置为与形成在所述可附接卡的底表面中的一个或多个连接垫形成电连接，其中所述座部构造成使得容纳所述可附接卡的空间为 向上打开