公开(公告)号：US10707071B2

公开(公告)日：2020-07-07

申请号：US15826916

申请日：2017-11-30

Applicant: Samsung Electronics Co., Ltd

Inventor： Won-Ho Jang ,  Hyun-Jung Lee ,  Se-Jin Park ,  Yong-Sun Ko ,  Dong-Gyun Han ,  Woo-Gwan Shim ,  Jeong-Yong Bae ,  Woo-Young Kim ,  Boong Kim

IPC: F26B7/00 ,  H01L21/02 ,  H01L21/67 ,  B08B7/00 ,  H01L21/687 ,  B08B3/08

Abstract: A substrate processing apparatus includes a chamber providing a space in which a substrate is processed, a first substrate support within the chamber and configured to support the substrate when the substrate is loaded into chamber, a second substrate support within the chamber and configured to support the substrate in a height greater than the height in which the first substrate supports the substrate, a first supply port through which a supercritical fluid is supplied to a first space under the substrate of a chamber space, a second supply port through which the supercritical fluid is supplied to a second space above the substrate of the chamber space, and an exhaust port through which the supercritical fluid is exhausted from the chamber.

公开(公告)号：US10668403B2

公开(公告)日：2020-06-02

申请号：US15482549

申请日：2017-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Min Oh ,  Ji-Hoon Jeong ,  Dong-Gyun Han ,  Kun-Tack Lee ,  Hyo-San Lee ,  Yong-Myung Jun

IPC: B01D53/02 ,  B01D11/04 ,  G01N21/3554 ,  H01L21/67 ,  H01L21/02 ,  B01D11/02

Abstract: A source supplier includes a source reservoir that contains a liquefied source fluid for a supercritical process, a vaporizer that vaporizes the liquefied source fluid into a gaseous source fluid under high pressure, a purifier that removes organic impurities and moistures from the gaseous source fluid and an analyzer connected to the purifier that analyzes an impurity fraction and a moisture fraction in the gaseous source fluid. Moisture and organic impurities are removed from the source fluid to reduce the moisture concentration of the supercritical fluid in the supercritical process.

公开(公告)号：US11361960B2

公开(公告)日：2022-06-14

申请号：US16892478

申请日：2020-06-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won-Ho Jang ,  Jeong-Yong Bae ,  Woo-Young Kim ,  Hyun-Jung Lee ,  Se-Jin Park ,  Yong-Sun Ko ,  Dong-Gyun Han ,  Woo-Gwan Shim ,  Boong Kim

IPC: F26B25/06 ,  H01L21/02 ,  H01L21/67 ,  B08B7/00 ,  H01L21/687 ,  B08B3/08

Abstract: A substrate processing apparatus includes a chamber providing a space in which a substrate is processed, a first substrate support within the chamber and configured to support the substrate when the substrate is loaded into chamber, a second substrate support within the chamber and configured to support the substrate in a height greater than the height in which the first substrate supports the substrate, a first supply port through which a supercritical fluid is supplied to a first space under the substrate of a chamber space, a second supply port through which the supercritical fluid is supplied to a second space above the substrate of the chamber space, and an exhaust port through which the supercritical fluid is exhausted from the chamber.