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公开(公告)号:US20220068613A1
公开(公告)日:2022-03-03
申请号:US17221891
申请日:2021-04-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seok Hwan BAE , Dong Hoon KIM , Byeong Sang KIM , Hak Young KIM , Hee Won MIN
IPC: H01J37/32 , H01L21/687 , H01L21/683
Abstract: Provided is plasma processing equipment comprising a substrate support, a focus ring disposed along an edge of the upper surface of the substrate support and including a fluid hole passing through a main body, an insulating ring surrounding an outer sidewall of the substrate support and including an inner side surface facing the outer sidewall of the substrate support, an outer side surface, and an upper surface connecting the inner and outer side surfaces. and including upper and lower end portions having different heights, and a connection end portion connecting the upper and lower end portions, a liner surrounding the outer side surface of the insulating ring and a baffle disposed on an upper surface of the liner, wherein a fluid passing through the fluid hole flows along the upper surface, and the baffle generates a pressure difference of the fluid between the upper and lower end portions.
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公开(公告)号:US20180035044A1
公开(公告)日:2018-02-01
申请号:US15666197
申请日:2017-08-01
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hwa Jun LEE , Dong Hoon KIM , Ji U SEO
CPC classification number: H04N5/23219 , G06K9/00228 , G06K9/00248 , H04N5/23216 , H04N5/23293 , H04N5/2351 , H04N5/2621
Abstract: Methods and apparatuses for processing an image in an electronic device is provided. An image is obtained, and it is determined whether a specified shape exists in the image. When the specified shape exists in the image, a size of an area occupied by the specified shape in the image is calculated. It is determined whether the size of the area is greater than or equal to a first size. A specified effect is applied to the area, when the size of the area is greater than or equal to the first size.
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