公开(公告)号：US20250105231A1

公开(公告)日：2025-03-27

申请号：US18772409

申请日：2024-07-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon KANG ,  Daegon KIM

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

Abstract: A semiconductor package including a package substrate defining a groove extending from an upper surface of the package substrate into the package substrate; a photonic integrated circuit (PIC) chip inside the groove of the package substrate; an interposer above the PIC chip and the package substrate, the interposer including a core substrate; an electronic integrated circuit (EIC) chip inside the interposer; and a semiconductor chip above the interposer. The interposer defines a cavity extending from an upper surface of the core substrate to a lower surface of the core substrate, and the EIC chip is inside the cavity of the core substrate.

公开(公告)号：US20250102748A1

公开(公告)日：2025-03-27

申请号：US18676584

申请日：2024-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junghoon KANG ,  Daegon KIM

IPC: G02B6/42 ,  G02B6/43

Abstract: A semiconductor package includes a redistribution layer on a substrate, a semiconductor chip on the redistribution layer, and a stack structure on the redistribution layer and spaced apart from the semiconductor chip in a horizontal direction, wherein the stack structure includes an optical integrated circuit chip, the first optical integrated circuit chip includes a first region adjacent to the semiconductor chip and a second region adjacent to an outer portion of the substrate, and the optical integrated circuit chip defines a first notch and a first groove in the second region, the first groove recessed upwards in a vertical direction from a lower surface of the optical integrated circuit chip, the first groove recessed downwards in the vertical direction from an upper surface of the optical integrated circuit chip.